Nikon Corporation

Nanometrics Inc.

Andrew H Barada

Andrew J Hazelton

Takehiko Ueda

Andrew Saul Klassen

Todd M Petit

Chuan Sheng Tu

An integrated metrology module includes a chuck for holding a sample and positioning the sample with respect to an optical metrology device, a reference chip for the optical metrology device, the reference chip being movable to various positions with respect to the optical metrology device, and a reference chip purge device provides a flow of purge gas or air over the reference chip while the reference chip is in the various positions. The reference chip purge device may be static or movable with the reference chip.

Optical metrology with purged reference chip

Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.

Chemical mechanical polishing end point detection apparatus and method

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Portola Valley, CA, United States of America

Andrew H Barada