The Boeing Company

Rockwell International Corporation

Theboeing Company

Andrew George Laquer

Ernest E Bunch

Julio A Navarro

Mark Andrew Lundgren

Albert Louis Bien

Richard Neal Bostwick

Yong U Kim

Dean L Araki

Rachael Dawn Morelli

Pohan Yang

Ryan Douglas Jones

Lathan Hunter Collins, Iii

John D Willams

Joshua Robert Laub

An unmanned aerial vehicle is provided, including an airframe including a fuselage and at least one stowable wing. The unmanned aerial vehicle can further include a radar panel positioned on the fuselage such that the radar panel is angled downward and extends longitudinally along a ventral region of the fuselage. The unmanned aerial vehicle can further include a drop-away rocket engine that is configured to detachably mount to the airframe adjacent the radar panel.

Unmanned aerial vehicle with sensor suite

A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).

Air-filled quad-ridge radiator for AESA applications

The present disclosure relates systems and methods for providing a three-dimensional device architecture for transistor elements in a power amplifier circuit. Namely, an example system may include a plurality of high electron mobility transistors disposed on a first substrate. A first portion of the plurality of high electron mobility transistors are electrically coupled via respective first level interconnects disposed on the first substrate. The system also includes a plurality of second level interconnects disposed on a second substrate. A second portion of the plurality of high electron mobility transistors are electrically coupled via respective second level interconnects. The first substrate and the second substrate are coupled such that the plurality of high electron mobility transistors provides an amplified output signal via at least one of the first level interconnects or the second level interconnects.

3D low flux, high-powered MMIC amplifiers

According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.

Ferrite composite sleeve systems and methods for coaxial applications

The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Direct semiconductor contact ebullient cooling package

A ballistic resistant antenna for use with a ballistic resistant communications system having a first plate fabricated from a ballistic material. The first plate has at least one opening configured to allow transmission of electromagnetic energy at a predetermined range of electromagnetic wavelengths. The antenna also has at least one plug having a geometry that is capable of insertion into the at least one opening. The at least one plug is made up of a material that is substantially transparent to the predetermined range of electromagnetic wavelengths.

Ballistic resistant antenna assembly

An RF transmitter, such as a radar transmitter or a communications amplifier, is provided that includes a plurality of RF power tube sections each sharing a common collector. The RF tube sections may comprise Klystron tubes, TWT tubes or other RF power tubes known in the art. A common modulator is also typically provided to modulate electron beams produced in each of the plurality of tube sections. The RF transmitter according to the present invention is considerably lighter and smaller relative to known multi-band RF transmitter structures that employ separate collectors and modulators. An associated RF amplification method that employs a common collector is also provided.

Dual-band RF power tube with shared collector and associated method

Pyrotechnic removal of a radome cover may be accomplished by scoring longitudinal recesses 50, preferably at least four, on the inner surface 26 of the cover 18. Explosives cord 38, shaped to preferentially detonate outward, is placed in the recesses 50, and is backed with a backing 48 to prevent damage to the underlying radome 12. Annular explosive cord sections 40 and 42 are placed at the nose 28 and rear end 20 of the radome cover 18. A detonator 34 explodes all cords simultaneously.

Growing community of inventors

Tustin, CA, United States of America

Andrew George Laquer