Kulicke and Soffa Investments, Inc.

Kulicke and Soffa Industries, Inc.

Sv Probe Pte. Ltd.

Solar Light Company, Inc.

Andrew F Hmiel

Rakesh Batish

Walt VonSeggern

C Scott Kulicke

David T Beatson

Glenn Sandgren

Bahadir Tunaboylu

Edward Lambert Malantonio

Michael H Bonitatibus

Jay M Silverman

Richard Withers

A device for collecting light from one or more incident light beams includes a first surface extending in a first plane and a second surface spaced-apart from the first surface. The second surface extends in a second plane parallel to the first plane. At least one of the first surface and the second surface including an optical polish or forming a reflective mirror coating. An edge surface extends from the first surface to the second surface. At least a portion of the edge surface forms a reflective mirror. At least one structure is formed in the first surface. The structure extends inwardly into the device from the first surface. The structure is configured to redirect light from a light source directed at the first surface.

System, apparatus and method for monitoring, detecting and/or sensing one or more light beam characteristics

A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

Probe tip plating

Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

System for reducing or eliminating semiconductor device wire sweep

A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

System and method for reducing or eliminating semiconductor device wire sweep

A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.

System and method for preventing and alleviating short circuiting in a semiconductor device

A wirebonded semiconductor package structure that provides for high frequency operation, a large number of I/O terminals, controlled low impedance, compensated inductance, electromagnetic shielding against cross-talk and prevention of false signals from ground bounce includes a semiconductor device, a semiconductor package substrate and a wirebond(s) electrically connecting the semiconductor device to the semiconductor package substrate. The wirebonded semiconductor package structure also includes a first insulating encapsulant layer at least partially encapsulating the wirebond(s) and a conductor layer (e.g., a patterned gold conductor layer) disposed on the first insulating encapsulant layer and electrically connected to the semiconductor package substrate. A method for manufacturing such a wirebonded semiconductor package includes wirebonding a semiconductor device (i.e., a die) to a semiconductor package substrate to form a semiconductor package structure that includes the die, the semiconductor package substrate and a wirebond(s) electrically connecting the die to the semiconductor package substrate. A first insulating encapsulant layer is then applied that at least partially encapsulates the wirebond(s). A conductor layer (e.g., a gold conductor layer) is subsequently applied on the first insulating encapsulant layer such that the conductor layer is electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure. Thereafter, the conductor layer is optionally patterned to form a patterned conductor layer that is electrically connected to the semiconductor package substrate.

Growing community of inventors

Glenside, PA, United States of America

Andrew F Hmiel