Hewlett-packard Development Company, L.p.

Agilent Technologies, Inc.

Andrew Douglas Delano

Brandon Rubenstein

Bradley Edgar Clements

Joseph M White

Eugene Arthur Miksch

Joseph M Whit

Systems, methodologies, and other embodiments are associated with a heat sink with a fin configured with a stator blade. One example includes a heat sink apparatus configured to experience a fan-assisted air flow. The example heat sink apparatus may be configured to include a fan that is configured to produce an air flow in the heat sink apparatus and a heat sink that houses the fan. The example heat sink may include a base and fins that are configured with stator blades.

Heat sink fin with stator blade

A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.

Variable-gap thermal-interface device

Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.

Bolster plate assembly for processor module assembly

A variable-height thermal-interface assembly for transferring heat from a heat source to a heat sink comprises a slidable interface between two contacting surfaces, the slidable interface inclined diagonally relative to the z-axis. The two contacting surfaces slide relative to one another parallel to the incline direction to provide z-axis expansion of the assembly. The assembly further comprises a spring clip, which when released applies a shear force across the slidable interface, causing the two contacting surfaces to slide relative to one another, coupling the sliding to provide z-axis expansion. The assembly further comprises a reversible locking device, which when locked prevents the two contacting surfaces from sliding relative to one another, such that the spring clip remains retracted, and when unlocked allows the two contacting surfaces to slide relative to one another, such that the spring clip is released.

Method of assembly of a wedge thermal interface to allow expansion after assembly

A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.

Variable-wedge thermal-interface device

A method for cooling integrated circuit assemblies uses a heat sink having a base and a displacement element having a size substantially similar to an area of heat concentration appropriately positioned on the integrated circuit. A compressive force placed upon the displacement element between the heat sink and the integrated circuit provides an optimum thermal resistance at an interface between the IC and the heat sink for efficient transfer of heat to the heat sink.

Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly

A variable-height thermal-interface device is provided for transferring heat from a heat source to a sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first cylindrically concave surface in slidable contact with a first cylindrically convex surface. The first cylindrically concave surface and the first cylindrically convex surface share a common first radius of curvature relative to a common first cylinder axis. The first cylindrically concave surface is operable to rotate about the common first cylinder axis relative to the first cylindrically concave surface to compensate for uniaxial angular misalignment between the source and the heat sink.

Variable height thermal interface

An apparatus for cooling an electronic device includes at least one angled flow control vane to divert a first airflow such that it blends with a second airflow that, prior to diversion of the first airflow, is substantially orthogonal to the first airflow. The efficient blending of the two airflows results in improved cooling of the electronic device.

Apparatus and method for cooling an electronic device

An improved apparatus and method for cooling integrated circuit assemblies uses a heat sink having a base and a displacement element having a size substantially similar to an area of heat concentration appropriately positioned on the integrated circuit. A compressive force placed upon the displacement element between the heat sink and the integrated circuit provides an optimum thermal resistance at an interface between the IC and the heat sink for efficient transfer of heat to the heat sink.

A joining process and friction welded structure is disclosed, including a first member with a conoid recess, and a second member with a second conoid tip that is friction welded to the recess in the first member. One, or both, of the conoids may be a non-spheroid, such as a paraboloid. In addition, the conoid recess may have a vertex angle that is greater than a vertex angle of the conoid tip.

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Fort Collins, CO, United States of America

Andrew Douglas Delano