Microsoft Technology Licensing, LLC

Andrew Douglas Delano

Lincoln Matthew Ghioni

David William Voth

Jeffrey Taylor Stellman

Timothy Allen Jakoboski

Kurt Jenkins

Taylor Stellman

Kabir Siddiqui

Jedd Perry

Ying Huang

Karsten Aagaard

David Otto Whitt, Iii

Edward Charles Giaimo, Iii

Yi He

Todd David Pleake

Andrew William Hill

Rob Huala

Duane Martin Evans

Virendra R Jadhav

Eric Paul Witt

Aaron Albert Oro

Gregory Nielsen

Bo Dan

Chau Van Ho

Kenneth Charles Boman

Rhishikesh A Sathe

Nathan Michael Thome

Kanth Kurumaddali

David Paul Platt

Lalit Anil Palve

Robert Ullman Myers

Lawrence David Azzano

Aaron Ray Paff

Siddharth Bhopte

Daniel Joseph Dummer

Nanqiang Zhu

Donovan D Van Sleet

Patrick Stephen Johnson

Jason Scott Watts

John R Haley

David Otto Iii Whitt

A thermal component has a shield portion and a heat exchanger portion. The shield portion includes a plurality of cells adapted to inhibit radio radiation (RF) having a frequency within a target frequency range, while the heat exchanger portion includes a plurality of elongated channels, each one of the elongated channels being physically connected to and in fluid communication with at least one corresponding cell of the plurality of cells.

Combined heat exchanger and RF shield

A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.

Dynamic balancing of additively manufactured impellers

Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.

Accessory device heat dissipation by parent device

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a heat generating component and a heat spreader physically connected to the heat generating component. The heat spreader includes a first surface and a second surface. The second surface is closer to the heat generating component than the first surface is to the heat generating component. The computing device also includes a layer of phase change material on at least a portion of the first surface, the second surface, or the first surface and the second surface of the heat spreader.

Passive thermal management system with phase change material

A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.

Integrated vapor chamber for thermal management of computing devices

Optimized charging of a battery of a computing device is provided. The computing device includes a dynamic phase change device. The dynamic phase change device includes a wick structure with a valve. The valve is operable to regulate a working fluid of the dynamic phase change device based on a position of the valve. The computing device also includes a battery physically connected to and in thermal communication with the dynamic phase change device, and a sensor operable to determine a temperature of the battery. The computing device includes a first heat generating component physically and thermally connected to the dynamic phase change device. The first heat generating component or a second heat generating component is configured to compare the determined temperature to a predetermined temperature and control the valve based on the comparison.

Dynamic thermal management for optimal battery charging

Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

Thermal management system including an elastically deformable phase change device

Thermal management systems and corresponding use methods are described herein. A thermal management system includes a thermal dock operable to cool a computing device in physical contact with the thermal dock. The thermal dock includes a housing, a first thermal management device supported by the housing, and a second thermal management device physically connected to the first thermal management device. The first thermal management device is a different type of thermal management device than the second thermal management device.

Thermal dock for a mobile computing device

Fan assemblies included within a computing device are described herein. The computing device includes a housing, a heat generating component supported within the housing, and a fan assembly. The fan assembly is operable to move heat generated by the heat generating component out of the housing. The fan assembly is supported within the housing. The fan assembly includes a shaft and a plurality of discs positioned along and fixed to the shaft. The shaft and the plurality of discs are rotatable relative to the housing about an axis of rotation.

Viscous flow blower for thermal management of an electronic device

Techniques for monitoring surface temperature of devices are described. Generally, surface temperature of devices is monitored and controlled to prevent user discomfort and/or injury that may result from user contact with an excessively heated surface. In at least some embodiments, temperature of an external surface of the device is indirectly monitored. For instance, a temperature sensor is positioned at an internal location in a device that has a known temperature relationship to a temperature of an external surface of the device. Alternatively or additionally, a temperature of an external surface of a device may be directly detected. In at least some embodiments, when a temperature of an external surface of a device is determined to reach or exceed a threshold temperature, procedures can be implemented to reduce the temperature of the external surface and/or prevent further heating of the external surface.

Monitoring surface temperature of devices

A lost wax cast vapor chamber device is provided. Once a mesh is produced, a meltable core is formed from a meltable core material with the mesh positioned at least partially inside the core. Over the meltable core a metallic layer is formed, at least partially surrounding the meltable core. A chamber formed by the metallic layer is exposed by melting the meltable core to cause it to be removed from an internal void of the chamber, the internal void encapsulating the mesh. The melted material from the meltable core flows out an opening on at least one surface of the chamber. Subsequently, the internal void is filled at least partially with a working fluid and the opening is closed. The mesh supports the surfaces of the chamber against deformation under the vacuum of the internal void. Movement of working fluid by capillary action is facilitated by the mesh.

Lost wax cast vapor chamber device

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

Black body radiation in a computing device

Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.

Display module with integrated thermal management structure

A spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy.

Spectrally selective radiation emission device

Growing community of inventors

Woodinville, WA, United States of America

Andrew Douglas Delano