Applied Materials, Inc.

Andrew Darlak

Swaminathan T Srinivasan

Peter I Porshnev

Igor V Peidous

Yen B Ta

Michael G Ward

Sunny Chiang

Methods for forming a device on a substrate are provided herein. In some embodiments, a method of forming a device on a substrate may include providing a substrate having a partially fabricated first device disposed on the substrate, the first device including a first film stack comprising a first dielectric layer and a first high-k dielectric layer disposed atop the first dielectric layer; depositing a first metal layer atop the first film stack; and modifying a first upper surface of the first metal layer to adjust a first threshold voltage of the first device, wherein the modification of the first upper surface does not extend through to a first lower surface of the first metal layer.

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Niskayuna, NY, United States of America

Andrew Darlak