Seagate Technology Incorporated

Andrew D Habermas

Mihaela Ruxandra Baurceanu

Joel William Hoehn

Ricky Ray Anderson

Jeff O'Konski

Chea Phann

Andrew Sherve

Raymond Leroy Moudry

Zubair Ahmed Khan

Dat Quach

Insik Jin

Lance Eugene Stover

Richard P Larson

Christina L Hutchinson

Daniel Sullivan

Yuhong Xiong

Jaewoo Nam

YongJun Zhao

Michael Thomas Johnson

Gary Joseph Kunkel

Mark Ostrowski

Dongming Liu

Edwin F Rejda

Joseph Michael Stephan

Roger L Hipwell

Daniel Richard Buettner

Kevin Lamber Mayer

Kevin Lambert Mayer

Kurtis Dean Loken

Zoran Jandric

Neil Zuckerman

Vasudevan Ramaswamy

Dongsung Hong

Greg Arthur Schmitz

Zhiyu Chen

Sarah R Marotz

Helena Pavlovna Stadniychuk

Kok Yen Goh

Willis J Johnson

PengKoon Hew

Joshua Zierhut

Charles J Mann

Nicholas Blum

Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Adhesive for processing a microelectronic substrate, and related methods

The present disclosure relates to methods of forming adhesive films having at least one pressure-sensitive adhesive polymer, related films, and related methods of using such films in lapping processes.

Methods of forming an adhesive layer, and related adhesive films and methods and systems of using adhesive films

The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

One or more conformal members used in the manufacture of a lapping plate, and related apparatuses and methods of making

The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making

The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.

Methods of lapping while heating one or more features, and related sliders, row bars, and systems

The present disclosure includes methods and systems that include multiple lapping stages having at least one lapping stage that laps while a heat source is applied to cause expansion during lapping and at least one subsequent lapping stage that laps while the heat source is reduced (e.g., turned off).

Methods of lapping a substrate while heating at least a portion of the substrate, and related substrates and systems

The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/&#x2212;5&#xb0; C., or even +/&#x2212;0.5&#xb0; C.

Lapping system that includes a lapping plate temperature control system, and related methods

The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

Apparatus for coating a lapping plate platen, and related methods of using

The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.

Methods and systems for providing electrical power to one or more heat sources in one or more sliders while lapping said sliders

Embodiments of the present disclosure demonstrate a lapping carrier system for a bar to be lapped. The lapping carrier system may be configured with a single piece insert whose bridge is separated from a plurality of joints of the carrier insert by a varying distance. The varying distance can be greater at a medial portion of the bridge than at an end portion of the bridge to collectively form a parabolic shape. In some embodiments, a lapping insert can include a bridge with its length longer than the bar. In some embodiments in a lapping insert, the centerline between the end joint edge and the end finger edge extends beyond the edge of bar.

Lapping carrier system with optimized carrier insert

The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).

Slider having angled or curvilinear sidewalls

Growing community of inventors

Eden Prairie, MN, United States of America

Andrew D Habermas