Microsoft Technology Licensing, LLC

Andrew Charles Banks

Gregory Mayo Daly

Garrett Douglas Blankenburg

Andres Felipe Hernandez

David Michael Sutherland

Jonathan Robert Pease

Nikita Ramesh Wanjale

The present disclosure relates to systems, methods, and computer-readable media for managing a cooling system to based on dynamic power and temperature conditions of computing hardware (e.g., a system on a chip (SOC), respective hardware blocks on the SOC). For example, systems described herein involve tracking real-time power and temperature conditions of computing hardware and determining a dynamic cooling level to actuate in maintaining a desired temperature of the computing hardware. This is done in a way that preserves long-term durability of the cooling system while maintaining the ability of the cooling system to respond to a potential spike in power consumption by the computing hardware.

Dynamically cooling system on a chip hardware

Examples are disclosed that relate cooling an electronic device based on power load. One disclosed example includes a controller configured to obtain a first measure of a power load, apply a filter to obtain a first filtered power load value, set a first thermal setpoint based at least on the first filtered power load value, determine a first temperature of the device, and adjust a response of the cooling mechanism based at least on the first thermal setpoint. The controller is further configured to obtain a second measure of the power load at a different time, apply the filter to obtain a second filtered power load value, set a second thermal setpoint based at least on the second filtered power load value, determine a second temperature of the device, and adjust the response of the cooling mechanism based at least on the second thermal setpoint.

Advanced power based thermal control systems

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Renton, WA, United States of America

Andrew Charles Banks