Lam Research Corporation

Lam Researech Corporation

Andrew C Lee

Michael C Kellogg

Christopher William Burkhart

Christopher J Pena

John Edward Daugherty

David J Hemker

A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.

Monolithic gas distribution manifold and various construction techniques and use cases therefor

Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.

Additively manufactured gas distribution manifold

Component-locating templates or masks for use with positioning fluid-flow components on monolithic ceramic substrates are provided, as well as techniques for the manufacture of such templates.

Monolithic manifold mask and substrate concepts

A manifold constructed by additive manufacturing for use in semiconductor processing tools is provided. The manifold may include a mixing chamber and portions of a plurality of flow paths with each flow path including a first fluid flow component interface, a second fluid flow component interface, a first tubular passage fluidically connecting the first mixing chamber with a first fluid flow component interface outlet of that flow path, and a second tubular passage fluidically connecting a first fluid flow component interface inlet of that flow path with a second fluid flow component interface outlet of that flow path. Each fluid flow component interface is configured to interface with a corresponding fluid flow component such that the corresponding fluid flow component, when installed, is able to interact with fluid flow between the fluid flow component interface inlet and the fluid flow component interface outlet.

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Daly City, CA, United States of America

Andrew C Lee