Mediatek Corporation

Andrew C Chang

Tzu-Hung Lin

Wen-Sung Hsu

Ta-Jen Yu

Tao Cheng

Shih-Chin Lin

Thomas Matthew Gregorich

Jing-Hong Conan Zhan

Chao-Long Tsai

Szu-Shan Lo

Chi-Kwong Ho

The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Semiconductor package and method for fabricating base for semiconductor package

In one configuration, a semiconductor package includes a conductive trace embedded in a base and a semiconductor device mounted on the conductive trace via a conductive structure, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace. In another configuration, a method for fabricating a semiconductor package includes providing a base, forming at least one conductive trace on the base, forming an additional insulation material on the base, and defining patterns upon the additional insulation material, wherein the pattern is formed on at least one conductive trace, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace.

A chip package structure and a method for forming a chip package are provided. The chip package structure includes a first package which includes at least a semiconductor die, a dielectric structure surrounding the semiconductor die, and a plurality of conductive structures penetrating through the dielectric structure and surrounding the semiconductor die. The package structure also includes an interposer substrate over the first package and a plurality of conductive features in or over the interposer substrate. The package structure further includes a second package over the interposer substrate, and the first package electrically couples the second package through the conductive structures and the conductive features.

Structure and formation method of chip package structure

A manufacturing method of a semiconductor package includes the follow steps. Firstly, a carrier is provided. Then, a package substrate is formed. Then, a first electronic component is disposed above the second conductive layer of the package substrate. Then, a second package body encapsulating the first electronic component and the second conductive layer is formed. Then, the carrier is carried. Wherein in the step of forming the package substrate includes a step of forming a first conductive layer on the carrier, a step of forming a first pillar layer on the first conductive layer, a step of forming a first package body encapsulating the first conductive layer and the first pillar layer and a step of forming a second conductive layer on the first pillar layer.

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer. The first electronic component is disposed above the second conductive layer of the package substrate. The second package body encapsulates the first electronic component and the second conductive layer.

Semiconductor package, semiconductor device using the same and manufacturing method thereof

A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet, forming a molding material covering the top surface, filling the first recesses, forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface, forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias, performing a second anisotropic etching process to remove a portion of the metal sheet from a bottom surface of the metal sheet until a bottom of the molding material is exposed, and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed.

Molded interposer package and method for fabricating the same

The invention provides a molded interposer package and a method for fabricating the same. The molded interposer package includes a plurality of metal studs. A molding material encapsulates the metal studs leaving the bottom surfaces of the metal studs exposed. A first chip is disposed on the molding material, connecting to the top surfaces of the metal studs. A plurality of solder balls connects and contacts to the bottom surfaces of the metal studs.

A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed.

The present invention relates to an information recording method to write a digital information file onto an information recording medium. The digital information file comprises a plurality of digital data and the information recording medium comprises a plurality of predetermined recording units which are arranged sequentially on said information recording medium from an inner area to an outer area in order to write the plurality of digital data on the digital information file. The inner area of the information recording medium has a data recording start area, and the data recording start area comprises a first start recording unit, where recording the plurality of digital data of digital information file supposed to start. This information recording method is starting from said first start recording unit to derive a second start recording unit through a predetermined counting procedure. Then starting from said second start recording unit rather than from said first start recording unit, write said digital data onto said information recording medium, wherein there are at least a plurality of recording units between said second start recording unit and said first start recording unit.

Information recording device and method of the same

A circuit in an optical read/write device for protecting synchronizing patterns is proposed. The protection circuit utilizes a clock with constant frequency as a reference clock. The circuit for protecting synchronizing patterns of this present invention includes a SYNC detector, a frame period counter, a valid-frame-period judgment unit, a frame period memory, a window generator, a real SYNC judgment unit, a SYNC lock judgment unit, and a SYNC signal generator. The circuit counts the pulse number of a reference clock with constant frequency for each frame to get a constant frame period. Then, the circuit can correctly interpolate the lost frame SYNC signal immediately by counting the reference clock, when the disk is defected.

Circuit for protecting synchronizing patterns

A data slice circuit and the method thereof The data slice circuit comprises a digitizer, a finite state machine, and a digitizer parameter adjustment element. The digitizer receives an analog signal and converts to a digital signal. The finite state machine generates a state signal in response to the digital signal. The digitizer parameter adjustment element generates a parameter adjustment signal in response to the state signal from the finite state machine. The digital signal of the digitizer is adjusted in accordance with the parameter adjustment signal.

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Hsinchu, Taiwan

Andrew C Chang