Semtech Corporation

Skorpios Technologies, Inc.

Other

Kitel Technologies LLC

Andrew Bonthron

Michael Nilsson

Darren Jay Walworth

Wei-Min Kuo

Stephen B Krasulick

Guoliang Li

Damien Lambert

Viktor Novozhilov

Phuoc Nguyen

David A Rowe

Richard N Nottenburg

Liping Zhang

Thomas W Krawczyk

Viktor Yevgenyevich Novozhilov

Phuoc Thanh Nguyen

An on-chip or built-in self-test (BIST) module for an RFIC is provided. The BIST module can be implemented in an RFIC system, which may include a beamforming module of a radar system. The BIST module may include components and methods to up-convert a signal from a test frequency to RF at an input to the RFIC and down-convert and output signal.

Method and apparatus for RF built-in test system for a beamforming module in a radar system

A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.

On-chip high capacitance termination for transmitters

A PAM (Pulse Amplitude Modulation) modulator driver is configured to receive a PAM input signal having N input amplitude levels and provide a PAM output signal having N output amplitude levels, where N is an integer. The PAM modulator driver circuit configured to electrically adjust amplitude levels in the PAM output signal.

Multi-level output driver with adjustable pre-distortion capability

A method of packaging one or more semiconductor dies includes: providing a first die having a circuit surface and a connecting surface; providing a chip-scale frame having an inside surface and an outside surface, the chip-scale frame having a well region having an opening in the inside surface; coupling the first die to a wall of the well region using a first coupling mechanism for electrical and mechanical coupling; providing a substrate having a top surface and a bottom surface; coupling the inside surface of the chip-scale frame with the top surface of the substrate by a second coupling mechanism, wherein a gap is provided between the circuit surface of the first die and the top surface of the substrate; coupling a heat sink to the outside surface of the chip-scale frame; attaching a lid to the chip-scale frame to form a substantially airtight chamber around the first die.

Chip-scale semiconductor die packaging method

Examples of circuits and methods are provided for common mode stability and bandwidth broadening. A current generator circuit may include a first and a second transistor. Each of the first and second transistors includes a first, second, and third terminal. The first and second transistors provide a first and a second output current at their corresponding third terminals. A first branch including a first resistor and a first capacitor coupled in series is coupled between the third terminal of the first transistor and the first terminal of the second transistor. A second branch including a second resistor and a second capacitor coupled in series is coupled between the third terminal of the second transistor and the first terminal of the first transistor. The first and the second branches are configured to enable the current generator circuit to provide the first and second currents with improved common mode stability.

Methods and circuits for common mode stability and bandwidth broadening in transistor amplifiers

A method of packaging one or more semiconductor dies is provided. The method includes: providing a first die having a circuit surface and a connecting surface; providing a chip-scale frame having an inside surface and an outside surface, the chip-scale frame having a well region having an opening in the inside surface; coupling the first die to a wall of the well region using a first coupling mechanism for electrical and mechanical coupling; providing a substrate having a top surface and a bottom surface; coupling the inside surface of the chip-scale frame with the top surface of the substrate by a second coupling mechanism, wherein a gap is provided between the circuit surface of the first die and the top surface of the substrate; coupling a heat sink to the outside surface of the chip-scale frame using a third coupling mechanism.

Modulator driver for driving an electro-optical modulator in a high-speed optical communications system. In accordance with aspects of the present invention, a modulator driver is presented comprising an input differential limiting amplifier which is coupled to a distributed differential current-switch configuration, where one set of outputs of the distributed differential current-switch configuration are grounded and the other set of outputs are connected to an artificial transmission line structure generating forward traveling and reverse traveling signals, with the reverse traveling signal termination bias inductively coupled to a separately adjustable positive bias voltage, whereby the circuit architecture reduces the number of components and transitions in the high-speed signal path and is compatible with compact, monolithic fabrication requiring a minimal amount of external components for operation. Other methods and apparatus are presented.

Compact high-speed modulator driver method and apparatus

A chip assembly may comprise a substrate having a top surface and a bottom surface. The chip assembly may comprise a first die having a circuit surface and a connecting surface, the circuit surface comprising one or more integrated circuits. The chip assembly may comprise a chip-scale frame having an inside surface, an outside surface, and a well region, the well region having an opening within the inside surface, the well region having a wall, the well region housing the first die, the first die attached to the wall by a first coupling mechanism, the inside surface coupled to the top surface of the substrate by a second coupling mechanism. The chip assembly may comprise a heat sink coupled to the outside surface of the chip-scale frame using a third coupling mechanism.

Chip assembly with chip-scale packaging

Apparatus for driving an optical system modulator to modulate data signals onto a light wave of the optical system. The modulator driver apparatus has a limited amplifier for receiving multiplexed low speed binary data signals and for generating amplified and limited frequency output signals representative of the received multiplexed binary data signals. A differential amplifier connected to an output of the limited amplifier precisely controls the amplitude and generates a low level of over and undershoot of output signals over a wide range of the limited amplifier output signals and has an output connected to central processor unit controlled linear amplifier means for generating gain controlled high fidelity output signals characterized with low over and undershoot and a high extinction ratio for driving the modulator.

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Los Angeles, CA, United States of America

Andrew Bonthron