Dow Corning Corporation

Andrew Anthony Mojica

Michael A Lutz

Dongchan Ahn

Kimmai Thi Nguyen

Dorab Edul Bhagwagar

Mark David Fisher

Michael John Watson

Conductive curable compositions contain a free radical polymerizable monomer, oligomer or polymer (i); an organoborane amine complex (ii), and an electrically or thermally conductive filler (iii). The conductive curable compositions can also contain an amine reactive compound having amine reactive groups (iv); and (v) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The electrically conductive curable compositions can be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured; and as electrically conductive rubbers, electrically conductive tapes, electrically conductive adhesives, electrically conductive foams, and electrically conductive pressure sensitive adhesives. The thermally conductive compositions can also be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured, and as thermal interface materials, thermally conductive rubbers, thermally conductive tapes, thermally conductive adhesives, thermally conductive foams, thermally conductive seals and gaskets, and thermally conductive pressure sensitive adhesives.

Conductive curable compositions

A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Thermally conductive phase change materials and methods for their preparation and use

A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin consisting essentially of R,SiO,units and SiO,units, wherein the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) 25 to 200 parts by weight of a silica filler having an average surface area less than 25 m,/g; and (E) a catalytic amount of a hydrosilylation catalyst. Each R,is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups. The mole ratio of R,SiO,units to SiO,units in the organopolysiloxane resin is from 0.6:1 to 1.5:1 and the resin contains less than about 2 mole percent of alkenyl groups. The sun of the average number of silicon-bonded alkenyl groups per molecule in component (A) and the average number of silicon-bonded hydrogen atoms per molecule in component (C) is greater than 4. A silicone pressure sensitive adhesive comprising a reaction product of the above-described composition. A multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B), when component (B) contains alkenyl groups, are present with components (C) and (E) in the same part.

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Freeland, MI, United States of America

Andrew Anthony Mojica