Applied Materials, Inc.

Andrew Anten

Richard W Plavidal

Gregory J Wilson

Eric J Bergman

Paul R McHugh

Randy Harris

Thomas H Oberlitner

Nolan Layne Zimmerman

Marvin L Bernt

Brian Aegerter

Sam Lee

Adam Marc McClure

Tricia A Youngbull

Timothy G Stolt

Bridger Earl Hoerner

Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.

Substrate cleaning components and methods in a plating system

Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.

Systems and methods for wetting substrates

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Kalispell, MT, United States of America

Andrew Anten