Intel Corporation

Andrew Alduino

Ling Liao

Mario J Paniccia

Ravindranath Vithal Mahajan

Ansheng Liu

Douglas E Crafts

Donald Tiendung Tran

Vladimir K Tamarkin

Srikant Nekkanty

Uri V Cummings

Daniel Daly

Dean Samara-Rubio

Siegfried B Fleischer

David Hui

Donald L Faw

Terrence Trausch

Brett Matthew Zaborsky

Rao S Peddada

Suresh V Pothukuchi

Sushrutha Reddy Gujjula

Christopher J Scholz

Harinadh Potluri

David M Bond

Christina A Frost

Dmitri E Nikonov

Henning Braunisch

Daoqiang Lu

James E Jaussi

Nitin A Deshpande

Remus Nicolaescu

Michael K Patterson

Kenneth Brown

Assia Barkai

Rongchung Tyan

David Funk

Sushrutha Gujjula

Bharadwaj Parthasarathy

Thomas Liljeberg

Rami Cohen

David Bond

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

Active bridge enabled co-packaged photonic transceiver

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Dual-sided co-packaged optics for high bandwidth networking applications

Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.

Thermal management using phase change material

Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.

Rack assembly structure

An electrical-optical coupling and detecting device. An apparatus according to an embodiment of the present invention includes a reflective surface defined on semiconductor material. The reflective surface is to reflect an incident optical beam towards an optical destination. An optical detector is monolithically integrated in the reflective surface of the semiconductor material. The optical detector arranged in the reflective surface of the semiconductor material is to detect the incident optical beam.

Integrated optical detector in semiconductor reflector

A split microprocessor socket is disclosed that provides a cavity created at an outer edge of the microprocessor socket. An optical module may be fitted in the cavity thus providing an optical fiber or waveguide connection directly to the socket. This low cost optical interconnect, closely packaged with the microprocessor, may alleviate bandwidth constraints associated with conventional electrical connections.

Split socket optical interconnect

An electrical-optical coupling device. An apparatus according to an embodiment of the present invention includes a first trench defined in a first semiconductor substrate. A first reflector is defined at a first end of the first trench in the first semiconductor substrate. The first reflector is angled with respect to an axis of the first trench. A first optical fiber is disposed in the first trench at a second end of the first trench. An optical source is mounted to the first semiconductor substrate proximate to the first trench. The optical source is optically coupled to the first optical fiber via the first reflector.

Method and apparatus providing an electrical-optical coupler

A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material. A four-terminal resistor is defined in the semiconductor material. At least a portion of the optical path is directed through the four-terminal resistor. The four-terminal resistor includes a first pair of terminals between which a probe current is to be injected. The four-terminal resistor also includes a second pair of terminals between which a voltage drop is to be measured so as to determine a resistance along the portion of the optical path directed through the four-terminal resistor. Temperature may be derived from the determined resistance of the four-terminal resistor. In one embodiment, the temperature of the semiconductor material may then be controlled with a heater in response to the derived temperature.

Method and apparatus for sensing a temperature along an optical path in semiconductor material

An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, and a plurality of lasers. The lasers are positioned to provide a first plurality of light beams substantially transverse to the first waveguide.

Optical amplifier with transverse pump

An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive.

High frequency emmitter and detector packaging scheme for 10GB/S transceiver

A semiconductor-based tunable add/drop method and apparatus. In one aspect of the present invention, a method according to an embodiment of the present invention includes splitting a first optical beam having multiple wavelengths into second and third optical beams with a first 3 dB optical coupler disposed in a semiconductor substrate. Portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of silicon and polysilicon interfaces, respectively, disposed along the semiconductor substrate. In another embodiment, the portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of modulated charged regions. Portions of the second and third optical beams not reflected are directed to a second 3 dB optical coupler disposed in the semiconductor substrate. The portions of the second and third optical beams not reflected are combined into a fourth optical beam with the second 3 dB optical coupler.

Method and apparatus for adding/droping optical signals in a semiconductor substrate

A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material, a grating disposed in the optical path, and a thermal probe including an optical sensor optically coupled to the grating to sense a spectral response of the grating. The thermal probe is adapted to determine a temperature of the optical path in which the grating is disposed in response to the spectral response of the grating.

Method and apparatus for sensing a temperature along an optical path with a grating in semiconductor material

An optical amplifier comprises a device substrate, a first waveguide embedded in the device substrate, a plurality of pumping waveguides coupled along interspersed portions of the first waveguide, and a plurality of lasers. The lasers are positioned to provide pumping light beams into the pumping waveguides.

Optical amplifier with distributed evanescently-coupled pump

Growing community of inventors

San Jose, CA, United States of America

Andrew Alduino