Intel Corporation

Andres Ramirez Macias

Gilberto Rayas Paredes

Bijoyraj Sahu

Aardra B Athalye

Chia-Pin Chiu

Je-Young Chang

David Shia

Jeffory L Smalley

Sandeep Ahuja

Phil Geng

Jin Yang

Devdatta P Kulkarni

Mohanraj Prabhugoud

Jessica Gullbrand

Susan F Smith

Shaorong Zhou

Shrenik Kothari

Jimmy Chuang

Javier Avalos Garcia

Yuyang Xia

Jorge Contreras Perez

Xiaojin Gu

Xicai Jing

Yuan-Liang Li

Maria De La Luz Belmont

Oscar Farias Moguel

Maria De La Luz Belmont Velazquez

Francisco Gabriel Lozano Sanchez

Anil Kumar Kurella

Samantha Yates

Aravind Munukutla

Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.

Flexible and modular top and bottom side processor unit module cooling

An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Boiling enhancement structures for immersion cooled electronic systems

A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Multi-surface heat sink suitable for multi-chip packages

Growing community of inventors

Zapopan, Mexico

Andres Ramirez Macias