Corning Incorporated

Andres Covarrubias Jaramillo

Daniel Wayne Levesque, Jr

Garrett Andrew Piech

Yuhui Jin

Robert Stephen Wagner

Aric Bruce Shorey

Ekaterina Aleksandrovna Kuksenkova

Michael S Pambianchi

Johannes Moll

Prashanth Abraham Vanniamparambil

Frank Andrew Kramer, Iv

Frank Andrew Iv Kramer

The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.

Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems

Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Rthat is less than or equal to 1 &#x3bc;m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.

Articles having holes with morphology attributes and methods for fabricating the same

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Corning, NY, United States of America

Andres Covarrubias Jaramillo