Cascade Microtech, Inc.

Suss Microtec Test Systems Gmbh

Andrej Rumiantsev

Stojan Kanev

Steffen Schott

Karsten Stoll

Michael Teich

Axel Schmidt

Botho Hirschfeld

Steffen Scott

A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate. The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Chuck for supporting and retaining a test substrate and a calibration substrate

An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Probe station for on-wafer-measurement under EMI-shielding

A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

A method is provided for calibration of a vectorial network analyzer, having n measurement ports (n&#x3e;1) and at least m measurement sites with n+1&#x3c;m&#x3c;2. Calibration includes measurement of three different n-port reflection standards connected between the measurement ports in any sequence, and measurement of different transmission standards connected between two measurement ports, and mathematical determination of the error coefficients of the network analyzer and the error-corrected scattering matrices [S] of the n-port calibration standards. The reflection standards, similar to shorts and opens, are unknown and the reflection standard implemented by wave terminations is known, but can be different at each n-fold one-port. The measurement of the transmission standards occurs on a transmission standard known in length and attenuation, which is implemented on each possible two-port by different combination of measurement ports. The unknown reflection values of the n-fold one-ports are determined mathematically by the measurements.

Method for calibration of a vectorial network analyzer

Method for calibrating a vectorial network analyzer, with n measurement ports (n&#x3e;2) and at least m measurement sites, where m&#x3e;n+1 includes measurement of three different n-port reflection standards, connected between measurement ports in any desired order, and successive measurement of reflection and transmission parameters at different transmission standards, connected between two respective measurement ports, and computational determination of error coefficients and error-corrected scattering matrices [S] of the n-port standards. Reflection standards, Short and Open, are unknown, but physically identical at each n-fold one-port. Reflection standard, realized by wave terminations, is known, but can be different at each n-fold one-port. Transmission standards are measured at a transmission standard, having known length and attenuation at a two-port, and at unknown transmission standards, identical for incident and reflected waves at remaining two-ports, which can be connected. Unknown reflection and transmission values are determined computationally by the measurements.

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Dresden, Germany

Andrej Rumiantsev