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Seeqc Inc.

Andrei Talalaeskii

Oleg A Mukhanov

Igor V Vernik

Daniel Yohannes

John Vivalda

Mario Renzullo

Jason Walter

Oleksandr Chernyashevskyy

Denis Amparo

A method for bonding two superconducting integrated circuits ('chips'), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

System and method for superconducting multi-chip module

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Mahopac, NY, United States of America

Andrei Talalaeskii