Finisar Corporation

Ii-vi Delaware, Inc.

Other

Finisar Sweden Ab

Ii-vi Delware, Inc.

Laird Technologies Gmbh

Cosemi Technologies, Inc.

Amc Centurion Ab

Tyco Electronics Svenska Holdings Ab

Andrei Kaikkonen

Nicolae Chitica

Lars-Goete Svensson

Lennart Per Olof Lundqvist

David Adams

Robert Lewén

Marek Grzegorz Chacinski

Peter Lindberg

Robert Monroe Smith

Lennart Lundqvist

Odd Steijer

Doron Lapidot

Theron Jones

Osamu Mizuhara

Christian Braun

Lennart Lundquist

Axel Von Arbin

Christopher Daunt

Jürgen Hauenschild

Lars-Goete Svenson

Simon Chen

Hans Magnus Emil Andersson

David Nidelius

Lars-Gote Svensson

Elisabeth Källén

Ermin Pasalic

Stefan Irmscher

Lukasz Kumanowski

Åsa Johansson

Nicolae Pantazi Chitica

Robert Smith

Lars-Göte Svensson

Marek Chacinski

Lena Apelskog Killander

Abdul Rahim

Teresa Meier

An electro-absorption modulator (EAM) is configured to include an on-chip AC ground plane that is used to terminate the high frequency RF input signal within the chip itself. This on-chip ground termination of the modulation input signal improves the frequency response of the EAM, which is an important feature when the EAM needs to support data rates in excess of 50 Gbd. By virtue of using an on-chip ground for the very high frequency signal content, it is possible to use less expensive off-chip components to address the lower frequency range of the data signal (i.e., for frequencies less than about 1 GHz).

Broadband electro-absorption optical modulator using on-chip RF input signal termination

A wideband electro-absorption modulating (EAM) device is configured to include a ground shield that functions to minimize the spread of an applied AC voltage beyond the limits of the modulator's electrode. The ground shield includes a grounding electrode disposed in a spaced-apart relationship with the modulator electrode along the ridge of the EAM structure, and a grounding termination used to couple the grounding electrode to a suitable ground location. The ground location may be either on-chip (such as the DC ground of the modulator itself) or off-chip (via an off-chip capacitor, with a wirebond connecting the grounding electrode to the capacitor). The use of a ground shield mitigates the effects that changes in the data rate have on effective length of the modulator as seen by the applied data signal.

Electro-absorption optical modulator including ground shield

An optical communication device may include a driver component, arranged to achieve a driving voltage, and a modulator component, including a laser or arranged to receive light from a laser. The modulator component may be arranged to achieve a modulated light signal modulated based on the driving voltage. The device may include a transmission line arranged to transfer the driving voltage between the driver component and the modulator component. The transmission line may not impedance matched to the driver component, the transmission line may have an impedance which is at least 20% lower than an output impedance of the driver component, and the transmission line may be impedance matched with respect to signal reflections to the modulator component.

Optical communication device

A semiconductor laser chip-on-carrier (CoC) device comprising:

Laser carrier-on-chip device

A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.

Carrier layout for an electro-optical module, an electro optical module using the same, and interconnect structure for coupling an electronic unit to an optical device

An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant &#x3b5;&#x3c;10, wherein the electrically insulating material provides a gap having an effective electrical distance of at least 80 &#x3bc;m between the photodiode substrate and the first heat sink.

Integrated optical transceiver

An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.

Interconnect structure for coupling an electronic unit and an optical unit, and optoelectronic module

An electro-optical modulator includes a substrate comprising a first Mach-Zehnder modulator comprising a first waveguide and a second waveguide and a second Mach-Zehnder modulator comprising a first waveguide and a second waveguide. A first positive signal electrode is positioned on the substrate over the first waveguide of the first Mach-Zehnder modulator and a first negative signal electrode is positioned on the substrate over the second waveguide of the first Mach-Zehnder modulator. The first positive signal electrode and the first negative signal electrode are connected to a first differential signal input. A second positive signal electrode is positioned on the substrate over the first waveguide of the second Mach-Zehnder modulator and a second negative signal electrode positioned on the substrate over the second waveguide of the second Mach-Zehnder modulator. The second positive signal electrode and the second negative signal electrode are connected to a second differential signal input. A first ground electrode is positioned on the substrate between the first and second Mach-Zehnder modulators connected to ground potential. A second ground electrode is connected to ground potential and positioned on the substrate adjacent to the first Mach-Zehnder modulator such that the first positive signal electrode and the first negative signal electrode are between the second ground electrode and the first ground electrode. A third ground electrode is connected to ground potential and positioned on the substrate adjacent to the second Mach-Zehnder modulator such that the second positive signal electrode and the second negative signal electrode are between the third ground electrode and the first ground electrode. A plurality of first electrical connectors connect the first ground electrode to the second ground electrode and a plurality of second electrical connectors connect the first ground electrode to the third ground electrode. A spacing between at least two of the plurality of first electrical connectors is chosen to achieve a desired cross talk between an optical signal generated by the first Mach-Zehnder modulator and an optical signal generated by the second Mach-Zehnder modulator.

Reduced-cross-talk coherent optical transmitter

The present invention relates to an apparatus for damping arid monitoring emissions from a light emitting device, particularly a vertical cavity surface emitting laser (VCSEL), comprising: a semi transparent substrate, preferably glass; a light emitting device for generating light emission; a damping layer deposited on a surface of the substrate; and a pair of electrodes, each of which being in direct contact with the damping layer. The damping layer is adapted to decrease the power level of the light emission of the light emitting device by absorption, to a desired level, for instance, to a level that meets eye safety limits. In addition, the damping layer is photosensitive to the light emission of the light emitting device, thereby allowing the pair of electrodes to output an electric signal corresponding to the power level of the light emission of the light emitting device.

Apparatus for damping and monitoring emissions from light emitting devices

An optical receiver is disclosed having a dielectric non-conductive substrate. A ground plane is positioned on the dielectric non-conductive substrate. An optical signal converting photodiode is also positioned on the dielectric non-conductive substrate, and has an optical signal receiver and an electrical signal output. An electrical signal amplifier is provided having an input connected to the electrical signal output of the optical signal converting photodiode. A first opening is positioned in the ground plane and surrounds the optical signal converting photodiode. The first opening has a resonance frequency higher than a fundamental frequency such that crosstalk is reducible at the input of the electrical signal amplifier.

Optical receiver and transceiver using the same

Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said electronic unit and a front end contact region for electrically contacting said interconnect structure by said further electronic component. A ground plane layer is electrically insulated from said pairs of signal leads, wherein each pair of signal leads has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and wherein in a region adjacent to said terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of signal leads and separated from a respective neighboring clearance.

Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end

An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.

Electrical connection interface for connecting electrical leads for high speed data transmission

The present invention relates to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate () and a plurality of signal lead pairs () to be coupled between said electronic unit () and a front end contact region () for electrically contacting said interconnect structure by said further electronic component. A ground plane layer () is electrically insulated from said pairs of signal leads (), wherein each pair of signal leads () has a circuit connecting region () for electrically contacting respective terminals of said at least one electronic unit (), and wherein in a region adjacent to said terminals of said at least one electronic unit () said ground plane layer () has a plurality of clearances () that are each allocated to one pair of signal leads () and separated from a respective neighboring clearance.

Growing community of inventors

Jaerfaella, Sweden

Andrei Kaikkonen