Nxp B.v.

Andrei-Alexandru Damian

Antonius Hendrikus Jozef Kamphuis

Amar Ashok Mavinkurve

Mustafa Acar

Paul Mattheijssen

Jan Willem Bergman

Jetse De Witte

Rajesh Mandamparambil

Marcellinus Johannes Maria Geurts

A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

Semiconductor device having uniform multi-package antenna array and method of manufacture

Embodiments of packaged semiconductor devices and methods of making thereof are provided herein, which include a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.

Conformal dummy die

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Nijmegen, Netherlands

Andrei-Alexandru Damian