Siemens Aktiengesellschaft

Mtu Aero Engines Gmbh

Bayerische Motoren Werke Aktiengesellschaft

Diehl Ako Stiftung & Co. Kg

Seimens Aktiengesellschaft

Mtu Aero Engines Ag

Andreas Volek

Robert Singer

Michael Ott

Uwe Paul

Hubertus Goesmann

Eckart Schumann

Volker Vosberg

Harald Wich

Jan Steinbach

Philipp Petz

Winfried Esser

Ursula Pickert

Matthias Oechsner

Dirk Goldschmidt

Axelle Hauck

Ralf Hojda

Frank Warmuth

Harald Heck

Jörn Grossmann

Jürgen Preuhs

Uwe Marx

Rolf Pechloff

Beate Seiler

Ralf Bürgel

Dirk Hopsch

Wolfgang Hermann

Jörg Seybold

Hael Mughrabi

Florian Pyczak

Alfred Scholz

A device for electrical interconnection of cells of a battery pack through cell connectors, and a battery pack having the device and the cell connectors are provided. A plurality of cell connectors for connection of at least two cell poles are fitted on a mounting plate, electrically isolated from one another. Each cell connector has at least one flexible bracket which extends away from a connection area. The flexible brackets are coupled to the connection area through a resilient structure having a meandering shape.

Device for electrically interconnecting cells in a battery pack by means of cell connectors and battery pack with such cell connectors

In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.

Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process

The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.

Method for repairing cracks in components and solder material for soldering components

The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

Repair soldering method for repairing a component which comprises a base material with an oriented microstructure

The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.

Solder material for soldering components

A high-temperature component made of a nickel super-alloy has the following composition in wt %: 11&#x2013;13% of Cr, 3&#x2013;5% of W, 0.5&#x2013;2.5% of Mo, 3&#x2013;5% of Al, 3&#x2013;5% of Ti, 3&#x2013;7% of Ta, 1&#x2013;5% of Re and a remainder formed of nickel. A corresponding component which is also provided is formed of an alloy having a composition essentially similar to that mentioned above, but with the rhenium proportion replaced with 0.1&#x2013;5 wt % of ruthenium.

High-temperature-resistant component and process for producing the high-temperature-resistant component

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Herzogenaurach, Germany

Andreas Volek