Schott Solar Ag

Rct Solutions Gmbh

Centrotherm Photovoltaics Ag

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Andreas Teppe

Adolf Muenzer

Jan Schoene

Steffen Keller

Ingo Schwirtlich

Berthold Schum

Wilfried Schmidt

Reinhold Schlosser

Peter Roth

Dieter Franke

Knut Vaas

Stefan Dauwe

Tobias Droste

Stefan Bagus

Peter Winter

Mathias Hein

Axel Metz

Jan Schöne

Adolf MÜNZER

Solar cell () having a dielectric coating arranged on a back side of the solar cell () which is at least partly covered by at least one planar contact (), a boundary line () of the at least one planar contact () having at least one recess (), and method for producing same.

Solar cell having a dielectric rear face coating and method for producing same

In a method for producing a solar cell, a layer stack of dielectric layers is applied to a back of a solar cell substrate and the layer stack is heated and is held at temperatures of at least 700&#xb0; C. during a time period of at least 5 minutes. The novel solar cell has a layer stack of dielectric layers on its back. At least one of the dielectric layers of the layer stack is densified so that its resistivity to firing-through of pastes with glass components is enhanced.

Solar cell having dielectric back reflective coating and method for the production thereof

A method for chemically treating a disc-shaped substrate having a bottom surface, a top surface and side surfaces by contacting a process medium that is fluid-chemically active with at least the bottom surface of the substrate. The substrate is moved relative to the process medium while forming a triple line between the substrate, the substrate medium and the atmosphere surrounding the substrate and medium. In order to chemically remove errors, particularly in the side surfaces, relative motion should be carried out while avoiding a contacting of the process medium with the top surface of the substrate, where the triple line is formed at a desired height of the side surface facing away from the process medium flow side in relation to the relative motion between the substrate and the process medium.

Method for chemically treating a substrate

A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.

Process for producing a contact area of an electronic component

Growing community of inventors

Constance, Germany

Andreas Teppe