Infineon Technologies Ag

Andreas Stueckjuergen

Michael Bauer

Walter Hartner

Thomas Fischer

Maciej Wojnowski

Werner Robl

Ulrich Wachter

Ottmar Geitner

Juergen Foerster

One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a separation layer over the barrier layer; forming a conductive layer over the separation layer; and wet etching the conductive layer.

Semiconductor structure and method for making same

A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.

Chip package and a method for manufacturing a chip package

Growing community of inventors

Wuppertal, Germany

Andreas Stueckjuergen