Steag Micro Tech Gmbh

Andreas Steinr&uuml;cke

Joachim Pokorny

A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.

Device and method for processing substrates

The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Substrate carrier

A fluid heater has a fluid pipe through which a fluid flows. A radiant heating element is enclosed in a quartz mantle. The fluid pipe is concentrically arranged about the quartz mantle. A first temperature sensor is positioned at a section of the outer circumference of the fluid pipe opposite the heating element.

Growing community of inventors

Talheim, Germany

Andreas Steinrücke

Growing community of inventors

Talheim, Germany

Andreas Steinr&uuml;cke

Andreas Steinrücke