Infineon Technologies Ag

Siemens Aktiengesellschaft

Qimonds Ag

Andreas Spitzer

Volker Lehmann

Reinhard J Stengl

Josef Willer

Hermann Wendt

Hans Reisinger

Gerhard Enders

Wolfgang Hoenlein

Elke Erben

Ulrike Gruning

A polycrystalline dielectric layer is formed wherein the dielectric layer comprises a first dielectric material containing an oxide or nitride and a second material contributing to less than 1% in weight to the dielectric layer, forming a non-conductive oxide or nitride having an enthalpy lower than the enthalpy of the first dielectric material such that a leakage current along grain boundaries of the first dielectric material is reduced.

Method of manufacturing a dielectric layer and corresponding semiconductor device

The invention relates to an integrated semiconductor memory with at least one memory cell having at least one transistor which forms an inversion channel in the switched-on state. The transistor comprises a structure element having a first source/drain region, a second source/drain region and a region arranged between the first and the second source/drain region, the structure element is insulated from a semiconductor substrate by an insulation layer, a gate dielectric being arranged on the structure element and a word line being arranged on the gate dielectric.

Integrated semiconductor storage with at least a storage cell and procedure

An integrated semiconductor memory is disclosed having selection transistors which can be formed at a respective ridge. The ridge can be arranged on an insulation layer. In the ridge the first source/drain region can be formed at one lateral end of the ridge and the second source/drain region can be formed at another lateral end of the ridge. The longitudinal sides of the ridge and a top side of the ridge can be covered with a layer stack including a gate dielectric and a gate electrode. High write-read currents can be achieved in the on state of the selection transistors and leakage currents occurring in the off state can be reduced.

Integrated semiconductor memory with a selection transistor formed at a ridge

Method for producing a silicon capacitor

For manufacturing a component with porous silicon, two highly doped regions with a lightly doped region arranged between them are formed in a silicon wafer. The dopant concentrations are thereby set such that porous silicon arises in the lightly doped region in a subsequent anodic etching. Light-emitting diodes or light-controlled bipolar transistors can be manufactured in this way.

Method for manufacturing a component with porous silicon

Growing community of inventors

Ottobrunn, Germany

Andreas Spitzer