Corning Incorporated

Andreas Simon Gaab

Garrett Andrew Piech

Heather Debra Boek

Sergio Tsuda

Michael Brian Webb

Albert Roth Nieber

Michael Albert Joseph, Ii

Alranzo Boh Ruffin

Ralf Joachim Terbrueggen

Daniel Arthur Sternquist

John Charles Speeckaert

Heather Nicole Vanselous

Richard Anthony Gaona

Dale Humphrey

John Eric Tyler

Nicolai Martin Haenel

A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or less, the plurality of defects forming a contour line on the substrate. The substrate having a first surface and a second surface that is opposite from the first surface. The method further includes exerting (i) a first force on the first surface of the substrate at a location that is adjacent to the contour line and (ii) a second force on the second surface of the substrate at a location that is on the contour line. Additionally, the method includes breaking the substrate along the contour line and into a first substrate portion and a second substrate portion.

Substrate cutting and separating systems and methods

A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

Methods for separating transparent articles from a transparent mother sheet using an open ended pressure assembly

A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength &#x3bb;, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching

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Grobenzell, Germany

Andreas Simon Gaab