Leica Microsystems Lithography Gmbh

Giesecke & Devrient Gmbh

Vistec Electron Beam Gmbh

Andreas Schubert

Rainer Plontke

Ines Stolberg

Wittich Kaule

Marius Dichtl

Joachim Heinitz

Michael Blume

Ines Stollberg

The invention relates to a device and a method for producing resist profiled elements. According to the invention, an electron beam lithography system is used to produce an electron beam, the axis of the beam being essentially perpendicular to a resist layer in which the resist profiled element is to be produced. The electron beam can be adjusted in terms of the electron surface dose in such a way that a non-orthogonal resist profiled element can be produced as a result of the irradiation by the electron beam.

Device and method for producing resist profiled elements

A device and a method for imaging and positioning a multiparticle beam on a substrate is disclosed. The device comprises a particle beam source with a condenser optic that produces a particle beam that illuminates the surface of an aperture plate. A multiplicity of individual beams are produced from the particle beam by means of the aperture plate, which are then projected by a projection system onto a substrate where they describe a beam base point. The substrate or target, respectively, is placed on a table that is movable along an x-coordinate and a y-coordinate, and that is provided with a laser path measurement system. The laser path measurement system relays positional data with a fixed clock rate to a synchronization and control devicethat positions the beam base point along the x-coordinate and the y-coordinate via a beam tracking system, taking into account the corrective data and pixel phase, whereby precise staircase beam-to-table positioning is achieved across the entire substrate in spite of faulty table movement.

Device and method for imaging a multiple particle beam on a substrate

In a method for forming, with the aid of an electron beam ( ), a polyline on a substrate ( ) coated with a radiation-sensitive resist, the electron beam ( ) is directed onto a surface of the substrate ( ) in the direction of a Z coordinate, and the substrate ( ) is displaced relative to the electron beam ( ) in an X-Y plane in individual steps. After each individual step of the displacement, the electron beam ( ) acts with a predefined energy input on the substrate ( ) during a halt in the displacement motion. The energy input for each individual step is determined as a function of the shape of the polyline ascertained from several preceding individual steps. Also described is a corresponding apparatus with which, using electron beam lithography, it is possible to form polylines with a very uniform line width. The method and apparatus are particularly suitable for writing curved polylines.

Method and apparatus for forming a curved polyline on a radiation-sensitive resist

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Niederrossla, Germany

Andreas Schubert