Vistec Semiconductor Systems Gmbh

Andreas Schaaf

Klaus Rinn

Michael Heiden

Artur Boesser

Andre Schepp

A method for determining the positions of structures () on a mask () is disclosed. The method is implemented in a metrology tool () comprising a measurement table () which is movable in X-coordinate direction and Y-coordinate direction. A first intensity profile (I) is recorded along a first measurement direction (MR), which is parallel to the X-coordinate direction. A second intensity profile (I) is recorded along a second measurement direction (MR), which is parallel to the Y-coordinate direction. A two-dimensional position of a centre of gravity (S) with respect to the coordinate system of the metrology tool () is determined from the first intensity profile (I) and the second intensity profile (I).

Method for determining positions of structures on a mask

A method for reproducibly determining object characteristics is disclosed. Herein an object is imaged onto a detector by means of an imaging optics and detected thereon. A correction function k is applied to a brightness measuring result N originally detected by a detector in such a way, that a corrected brightness measuring result N' is proportional to a brightness I impinging on the detector.

Method for reproducibly determining geometrical and/or optical object characteristics

A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined.

Method for improving the reproducibility of a coordinate measuring apparatus and its accuracy

A method for the high-precision measurement of coordinates of at least one structure on a substrate. A stage traversable in X/Y coordinate directions is provided, which is placed in an interferometric-optical measuring system. The structure on the substrate is imaged on at least one detector () via a measuring objective () having its optical axis () aligned in the Z coordinate direction. The structure is imaged with the so-called Dual Scan. Systematic errors can thereby be eliminated.

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Mittenaar-Bicken, Germany

Andreas Schaaf