Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Flexchip Ag

Plettner, Andreas

Andreas Plettner

Karl Haberger

Christof Landesberger

Arno Stein

A unit for shielding a transponder includes at least a chip and an antenna structure with application-specific spatial dimensions and which is secured to an electrically conductive surface. The unit includes a film having formed thereon or therein a highly permeable material at least in an area having the spatial dimensions of the antenna structure of the transponder. The highly permeable material is subdivided into elongate shielding elements and free spaces arranged between the respective shielding elements such that when the substrate has been attached to the transponder, the shielding elements will be oriented parallel to a magnetic field induced in the antenna structure of the transponder, so as to suppress eddy currents which are generated by the electrically conductive surface in the antenna structure, when the transponder is being introduced in a magnetic field of a respective reading device.

Device for shielding a transponder, method for producing a corresponding shielding and transponder provided with said shielding

In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.

Method for handling a plurality of circuit chips

The present invention relates to a method of producing very thin substrate layers, particularly thin semiconductor areas, which may comprise integrated circuits. In the method two substrates ( ) are bonded by their faces via one or several intermediate connecting layers ( ). At least one of the bonding layers or the face of one of the substrates is structured before in such a way that channel-shaped recesses ( ) are formed which permit a lateral penetration of an etching agent. The resulting wafer stack is thinned from one side down to the desired thickness of the layer. Finally, this thin layer is detached from the remaining substrate by introduction of the etching agent into the channel-shaped recesses. This detaching process is a low-price wet chemical process that does not expose the chip and the added value integrated thereon to any risk.

Method for producing thin substrate layers

A data recorder has at least one sensor unit to compile at least one measurement value to be recorded during a monitoring interval, a control unit to control the compiling and recording of measurement data, a clock unit to provide a reference time on the basis of which the actual measurement times can be defined, a memory unit to store the measurement values compiled and the corresponding reference time provided for each measurement value, a battery unit for power supply, a fixation unit to fix the data recorder to an item to be monitored, and an interruption unit which interrupts the recording and/or compiling of measurement data upon any manipulation of the fixation unit.

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Feldafing, Germany

Andreas Plettner