Epcos Ag

Tdk Electronics Ag

Andreas Peschka

Harry Hedler

Karl Weidner

Jan Ihle

Jörg Zapf

Bernhard Ostrick

Benjamin Bohl

Bettina Milke

Bert Hundertmark

Michael Schiffer

A sensor including a deformation body having a membrane for deformation when subjected to pressure from a medium. The sensor further includes a strain element applied to and attached to the membrane. The strain element is based on SOI technology and has multiple piezoresistive resistors.

Sensor and method for producing a sensor

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to &#x2212;40&#xb0; C. and less than or equal to 150&#xb0; C.

Pressure sensor system

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

Micromechanical measuring element and method for producing a micromechanical measuring element

Growing community of inventors

Michendorf, Germany

Andreas Peschka