Robert Boschgmbh

Andreas Moehrle

Nikolai Bauer

Moritz Winkler

Michael Gockel

Johannes Eschler

Peter Diesel

Joerg Engelhardt

Reiner Ramsayer

Hans-Georg Drotleff

Guido Bernd Finnah

Ahmad Faridian

Daniel Beurer

A method for producing a camera module. An objective is aligned with respect to an image sensor and is then fixed in position by being joined to a support that receives the image sensor, a housing that surrounds the image sensor, or an interposed connection structure as a joining partner. The objective is mounted on spacer elements, which are initially still movable, and is then aligned with respect to the image sensor by moving the spacer elements. After the objective is aligned, the spacer elements are welded to the objective and the joining partner. A camera module is also described.

Method for producing a camera module, camera module

A method for joining a camera module, including a base plate on which an image sensor is situated, and an objective mount in which an objective of the camera module is accommodated. The base plate is placed on the objective mount, and at least one spring element is laterally mounted and positioned at each of at least two connection areas that are oppositely situated with respect to the optical axis of the camera module. The base plate and the objective mount are pressed flatly against one another via the spring element.

Method for manufacturing a camera module

A method for manufacturing a camera module. An objective is aligned in relation to an image sensor and is subsequently fixated in terms of position by connecting to a support receiving the image sensor or to a housing surrounding the image sensor. The objective is connected to the support or to the housing via at least two cylindrical pins, the cylindrical pins being in each case placed laterally against the objective and being welded on the one hand to the objective, and on the other hand to the support or the housing. A camera module is also described.

Method for manufacturing a camera module, camera module

A camera module that includes an objective lens with an electrical interface and a device for electrically contacting the objective lens in the area of the electrical interface. The device for electrically contacting are also connected to an electronics system, in particular to a circuit board, of the camera module. The electrical interface is formed at the objective lens on the outer circumferential side, and the device for electrical contacting includes an annular body situated on the objective lens on the outer circumferential side, with contacts formed on the inner circumferential side. A method for manufacturing a camera module is also provided.

Camera module, method for manufacturing a camera module

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

An image detection unit for a vehicle. The image detection unit includes an objective including an electrical contact surface, a sensor carrier including a detection sensor situated on the sensor carrier and an electrical contact point. The detection sensor and the contact point are situated at a surface of the sensor carrier that faces the objective. The image detection unit further includes a flexible contacting element for an electrical connection between the contact surface of the objective and the contact point of the sensor carrier.

Image detection unit for a vehicle and method for manufacturing an image detection unit

A camera module. The camera module includes a circuit board on which at least one image sensor is situated; an objective including a lens housing and multiple optical lenses situated inside the lens housing; an objective holder, which is connected to the circuit board and is designed to hold the objective; and at least one temperature control element, which is designed to influence the temperature of at least one front lens of the objective; a second optical lens being situated at the front lens. The front lens and/or the second optical lens includes/include at least one recess, the at least one temperature control element being situated in the at least one recess.

Camera module and method for manufacturing a camera module

A method for joining a camera module, which includes a base plate on which an image sensor is situated, and an objective holder in which an objective of the camera module is accommodated. The base plate and the objective holder are aligned relative to each other in a connection region and a connecting pin is guided through a recess of the base plate and/or the objective holder so that the connecting pin protrudes on the outside, and the at least one free end of the connecting pin is widened by a forming die using a radially acting deformation force such that the base plate and the objective holder are pressed against each other.

Method for producing a camera module

A method for attaching a camera objective to an objective holder. The method includes the steps of introducing the camera objective into an attaching element in the region of the objective holder, the attaching element having a plurality of contact elements that extend from a base body and lie elastically on the camera objective, of orienting the camera objective to an image sensor, and of welding the attaching element using a laser, so that the position of the camera objective to the objective holder is fixed.

Method for attaching a camera objective to an objective holder

A component assembly that includes a connection between two components, in particular an electronic circuit board and a housing. The connection includes a pin-shaped connector via which the electronic circuit board is held on the housing, and the pin-shaped connector in a passage of the housing being connected to the housing via a housing caulking. The pin-shaped connector, in the area of the housing caulking, includes a recess that cooperates with the housing caulking in such a way that the pin-shaped connecting means is held in the passage.

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Kornwestheim, Germany

Andreas Moehrle