Rogers Germany Gmbh

Curamik Electronics Gmbh

Laserline Gesellschaft Fur Entwicklung Und Vertrieb Von Diddenlasern Gmbh

Andreas Meyer

Jürgen Schulz-Harder

Stefan Britting

Karsten Schmidt

Vitalij Gil

Tilo Welker

Rainer Herrmann

László Müller

Volker Krause

Karl Exel

Eckart Hoene

Xinhe Tang

Christoph Ullmann

Lothar Kugler

Johannes Wiesend

Ruben Kahle

Fabian Hierstetter

Nico Kuhn

Christoph Wehe

Manfred Götz

Alexander Legath

Fabian Wagle

Dieter Knöchel

Martina Schmirler

Andrea Adler

David Bierwagen

Martin Reger

Christoph Marczok

Tina Thomas

Sebastian Polster

László MÜLLER

The invention relates to a process for producing a metal-ceramic substrate (), comprising:

Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method

Method of manufacturing a metal-ceramic substrate () which, in the finished state, has a ceramic layer () and a metal layer () extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer () and the ceramic layer () and bonding the metal layer () to the ceramic layer () in regions to form a first region (B), which has a materially bonded connection between the metal layer () and the ceramic layer (), and a second region (B), in which the metal layer () and the ceramic layer () are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).

Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method

An electronics module (), especially a power electronics module, comprising

Electronic module and method for producing an electronic module

A method for manufacturing a metal-ceramic substrate () includes

Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method

A system for cooling a metal-ceramic substrate () having a component side () and a cooling side () opposite the component side (), comprising

System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the system

Metal-ceramic substrate and method for producing a metal-ceramic substrate

The present invention proposes a carrier substrate () for electrical components (), the carrier substrate () having a component side () and a cooling side () which is opposite the component side () and has a cooling structure (), the carrier substrate () comprising a primary layer () which faces the component side () and is produced from ceramic for electrical insulation, and a secondary layer () which faces the cooling side () for stiffening the carrier substrate (), characterized in that a metallic intermediate layer () is arranged between the primary layer () and the secondary layer () for heat transfer from the component side () to the cooling side (), the metallic intermediate layer () being thicker than the primary layer () and/or the secondary layer ().

Carrier substrate with a thick metal interlayer and a cooling structure

A cooling device () for cooling an electrical component (), in particular a laser diode, including

Cooling device for cooling an electrical component and method for producing a cooling device

A soldering material () for active soldering, in particular for active soldering of a metallization () to a carrier layer () comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

Soldering material for active soldering and method for active soldering

A carrier substrate () that includes an insulation layer () and a metal layer (), wherein a flank profile (), in particular an etching flank profile, at least zonally borders the metal layer () in a primary direction (P) extending parallel to the main extension plane (HSE), wherein, viewed in the primary direction (P), the flank profile () extends from a first edge () on an upper side () of the metal layer (), which faces away from the insulation layer (), to a second edge () on a lower side () of the metal layer (), which faces the insulation layer (), characterized in that the flank profile (), viewed in the primary direction (P), has at least one local maximum () and at least one local minimum ().

Carrier substrate for electrical, more particularly electronic, components, and method for producing a carrier substrate

A substrate () for electrical circuits, comprising at least one metal layer () and a paper ceramic layer (), which is joined face to face with the at least one metal layer () and has a top side and bottom side (), wherein the paper ceramic layer () has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer () is connected to the paper ceramic layer () by means of at least one glue layer (), which is produced by applying at least one glue (&#x2033;) to the metal layer () and/or to the paper ceramic layer (), wherein the cavities in the form of pores in the paper ceramic layer () are filled at least at the surface by means of the applied glue (&#x2033;).

Substrate for electrical circuits and method for producing a substrate of this type

The invention relates to a substrate () for electrical circuits comprising at least one first composite layer () which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer () and an aluminium layer () attached thereon, wherein at least the surface side of the aluminium layer () facing away from the copper layer () is anodized for the generation of an anodic or insulating layer () made of aluminium oxide, and wherein the anodic or insulating layer () made of aluminium oxide is connected to a metal layer () or at least one second composite layer (') or at least one paper-ceramic layer () via at least one adhesive layer (&#x2032;).

A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 &#x3bc;m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.

Method for producing a composite material

The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer. Subsequently, the metal layers forming the metal container with the at least one ceramic layer received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300&#xb0; C. and the melting temperature of the metal layers for producing a preferably flat connection of at least one of the metal layers and the at least one ceramic layer, and at least the projecting free edge sections, which are connected to each other, of the metal layers for forming the first and second metallization are subsequently removed.

Growing community of inventors

Wenzenbach, Germany

Andreas Meyer