Corning Optical Communications LLC

Corning Research & Development Corporation

U2t Photonics Ag

Corning Cable Systems

Ccs Technology Corporation

Andreas Matiss

James Phillip Luther

Eric Stephan Ten Have

Douglas Llewellyn Butler

Michael De Jong

Micah Colen Isenhour

James Scott Sutherland

Alan Frank Evans

Martin Spreemann

Wojciech Piotr Giziewicz

Jerald Lee Overcash

Christoph Clemens Leonhardt

Ying Geng

Christopher Paul Lewallen

Michael Wimmer

Davide Domenico Fortusini

Lars Martin Otfried Brusberg

Percil Watkins

Alexander Jacob

Michael Margraf

Tim Grygiel

Dirk Trommer

Christoph Leonhardt

Christoph C Leonhardt

A method of assembling a wavelength division multiplexing (WDM) cassette for a fiber optic network is disclosed and includes attaching a first plurality of wavelength filters to a first cassette workpiece, attaching a second plurality of wavelength filters to a second cassette workpiece, organizing the optical fibers extending from the wavelength filters, adjusting a length of the optical fibers extending from wavelength filters, and forming an optical connection between the optical fibers from the wavelength filters via a mass fusion splice. The first cassette workpiece and the second cassette workpiece are separate from each during at least one of the attaching, organizing, adjusting, and forming steps. The optical fibers may have predetermined lengths for being arranged in a helix configuration and folded to produce an organized fiber stack that fits within the confines of the cassette. A WDM cassette having an organized arrangement of optical fibers is also disclosed.

Wavelength division multiplexing cassette for a fiber optic network and method of making same

A redundant wavelength division multiplexing (WDM) device including a first common port which includes a collimator configured to transmit a first optical beam. The first beam includes a first plurality of optical signals. A second common port includes a collimator configured to transmit a second optical beam that includes a second plurality of optical signals. The second common port is spaced apart from the first common port and a plurality of filters define an optical path for each of the first optical beam and the second optical beam. Each filter is oriented to interact with each of the first optical beam and the second optical beam. A method of processing light includes transmitting one of the first optical signals of a first wavelength through a first filter and transmitting one of the second optical signals of the first wavelength through the first filter.

Redundant wavelength division multiplexing devices and methods for processing light using same

An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Integrated electrical and optoelectronic package

A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.

Universal photonic adaptor for coupling an optical connector to an optoelectronic substrate

Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Detachable optical connectors for optical chips comprising a connector support and methods of fabricating the same

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

Silicon-based optical ports providing passive alignment connectivity

Disclosed are optical plugs and optical connectors having one or more integral alignment features used for making optical connections. In one embodiment, an optical connector comprising an optical body and at least one magnetic attachment. The optical body comprises a front side with a first surface, an optical section comprising at least one optical channel, and a datum section disposed on a second surface of the front side and comprising one or more integral alignment features. The optical body also comprises a circuit mounting portion disposed at a rear side of the optical body. The datum section may be arranged on opposite sides of the optical section. Further, the one or more integral alignment feature may be arranged at a top and a bottom of the datum section for alignment in a first direction. The first surface may also be recessed from the second surface.

Optical connections having integral alignment structure

The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. One method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Methods of forming a fiber coupling device and fiber coupling device

The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. The method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

A multi-core optical fiber () comprises a plurality of optical cores () to respectively transmit light and a plurality of cleaves () extending from a surface () of the multi-core optical fiber () into the multi-core optical fiber. A first cleave () comprises a surface () to couple light out of the optical fiber, wherein a first optical core () ends at the surface () of the first cleave (). An at least one second cleave () comprises a surface () to couple light out of the optical fiber, wherein at least one second optical core () ends at the surface () of the at least one second cleave (). The first and the at least one second cleave () are staggered along the longitudinal axis () of the multi-core optical fiber ().

Multi-core optical fiber

Systems and methods of aligning an optical interface assembly with an integrated circuit (IC) are disclosed. The method includes emitting light from an optical transmitter, passing the emitted light through the optical interface assembly in a first direction, and reflecting the emitted light from a reflective surface disposed immediately adjacent a front end of the optical interface assembly to define reflected light that travels back through the optical interface assembly in a second direction that is substantially opposite the first direction. The reflected light is received by an optical receiver that generates in response a receiver signal. The relative position of the optical interface assembly and the IC is adjusted to achieve an aligned position based on the receiver signal. The disclosure is also directed to a test plug for aligning an optical interface assembly to the IC.

Systems and methods for aligning an optical interface assembly with an integrated circuit

An embodiment of the invention relates to a system comprising an optical device () and an evaluation device () for characterizing the optical device. The optical device comprising a 90&#xb0; optical hybrid unit () having a first and second optical input (EE) and at least two optical outputs (A-A) wherein optical output signals (So-So) leaving the optical outputs have optical phase differences between each other of 90&#xb0; or multiple thereof; a first photodetector (P) connected to a first optical output (A) and a second photodetector (P) connected to a second optical output (A), wherein the first optical output emits a first optical output signal (So) and the second optical output emits a second optical output signal (So), said second optical output signal having an optical phase difference of 180&#xb0; relative to the first optical output signal; and a first transimpedance amplifier (Tr) connected to the first and second photodetectors (P, P). The evaluation device () is characterized by a signal source () configured to generate a first and second intensity-modulated optical input signal (Sin, Sin); an optical phase shifter () adapted to phase-shift the optical phase of the second intensity-modulated optical input signal relative to the optical phase of the first intensity-modulated optical input signal; a measurement unit () adapted to measure the electrical output signal of the first transimpedance amplifier (Tr); and a control unit () adapted to control the optical phase shifter.

Method and system for characterizing an optical device

An arrangement including an electrical conductor track carrier and a component applied on the conductor track carrier. The component is a fiber-optoelectronic component and has: a housing, at least one electro-optical or optoelectronic component, at least one fiber-optic interface connected to the electro-optical or optoelectronic component, and at least one electrical interface for connecting the component on the conductor track carrier. The electrical interface has at least one bent electrical soldering connection element which is attached by one end to a base connection section of the housing base and extends from there laterally toward the outside so that the other end of the soldering connection element projects laterally and is soldered laterally outside the outer housing contour on the conductor track carrier. The soldering connection element is bent away from the base connection section so that the base connection section is at a distance from the conductor track carrier.

Growing community of inventors

Berlin, Germany

Andreas Matiss