Robert Bosch Gmbh

Andreas Markus Uyttendaele

Lukas Alter

A method for connecting a film () to a substrate () includes providing () a film () and a substrate (), bringing () the film () and the substrate () together, applying () at least one clamping force in at least one clamping region (), in which the clamping force acts to establish a contact of the film () with the substrate (), and heating () the film () and/or substrate () in at least a respective connecting region () in which the film () and the substrate () are connected together. The clamping force is maintained during the heating process, yet the film () and the substrate () can be moved relative to one another in the clamping region ().

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Stuttgart, Germany

Andreas Markus Uyttendaele