Diamond Innovations. Inc.

Andreas Markstrom

Susanne Norgren

Yuanbo Lin

Malin Martensson

A sintered cutting element including a superabrasive layer supported on a substrate. The superabrasive layer includes superabrasive material and secondary phase, and the substrate includes a binder phase. The sintered cutting element is formed by a high temperature high pressure sintering process in which separate source elements melt and sweep first through the superabrasive layer, and then to the substrate to form the secondary phase and binder phase. The superabrasive layer is substantially free of or free of eta-phase, CoWC. Further, the portion of the substrate nearest the interface between the superabrasive layer and the substrate has equal or more binder phase than portions of the substrate further from the interface. In certain embodiments, the superabrasive material includes polycrystalline diamond, and the substrate includes cobalt tungsten carbide.

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Stockholm, Sweden

Andreas Markstrom