Bystronic Laser Ag

Andreas Lüdi

Simon Scheidiger

Titus Haas

Roland Bader

Michael Berger

Daniel Cathry

Stefan Wittwer

Michael Held

Elio Ingold

Markus Burri

Beat Dubach

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K. . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

Laser process monitoring

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K. . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.

A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.

Laser-machining device

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Burgdorf, Switzerland

Andreas Lüdi