Average Co-Inventor Count = 2.93
ph-index = 7
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Dow Global Technolgoies LLC (34 from 4,629 patents)
2. Ddp Specialty Electronic Materials Us, LLC (5 from 93 patents)
3. Dupont Specialty Products Usa, LLC (1 from 4 patents)
4. Ddp Specialty Electronics Materials Us, Inc. (1 from 2 patents)
5. Ddp Specialty Electronic Material Us, LLC (1 from 1 patent)
42 patents:
1. 11866618 - Glass bonding adhesive with reduced slippage
2. 11820922 - Adhesive composition
3. 11739241 - High temperature epoxy adhesive formulations
4. 11674063 - Epoxy resin adhesive compositions
5. 11499075 - Isocyanate functional adhesive which bonds primerless to silanated acrylic polyol based coatings
6. 11274236 - One-component toughened epoxy adhesives containing a mixture of latent curing agents
7. 11173672 - Method for bonding using one-component epoxy adhesive mixtures
8. 11034869 - One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance
9. 10815405 - One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
10. 10450486 - Dual cure 1K PU adhesive formulations using matrix encapsulated polyamines
11. 10435600 - Epoxy resin compositions for pre-gel ovens
12. 10392539 - Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
13. 10190028 - Epoxy two-part formulations
14. 10155891 - One-component structural adhesive containing isocyanate-terminated prepolymer
15. 10155838 - Structural PU adhesive for composite bonding