Bystronic Laser Ag

Andreas Luedi

Simon Scheidiger

Martin Mumenthaler

Roland Bader

Titus Haas

Markus Steinlin

Michael Berger

Daniel Cathry

Roland Zollinger

Christoph Fahrni

Stefan Alfons Jacobi

Christoph Fahmi

Kevin Messer

Joël Baertschi

Matthias Schranz

Thomas Pinder

Stefan Kaltenbach

Patrick Herwig

Michael BRÜGMANN

The invention relates to a calibration module for calibrating a real-time estimator, which is intended for quality estimation of a cutting method using a laser cutting machine, comprising: a load interface for loading a quality estimation result of the real-time estimator; a first processor, which is intended to provide a quality measurement result of the cutting edge of the workpiece, wherein the quality measurement result can be provided in particular by detecting measurement signals of a cutting edge of a finished cut workpiece by means of a measuring device; and wherein a second processor is intended to compare the loaded quality estimation result with the quality measurement result and based on the result: is intended to calculate a calibration data set for calibrating the real-time estimator an output interface (A) which is intended to output the calculated calibration data set.

Calibration of a quality estimator for a laser cutting method

The present disclosure relates to a machining apparatus for laser machining a workpiece, such as laser cutting. The apparatus includes a machining laser source for generating a machining laser beam; an illumination laser source having a power for generating an illumination laser beam having a spectral range; an outlet opening for the machining laser beam and the illumination laser beam; and a laser beam guiding device which is designed such that the machining laser beam and the illumination laser beam emerge coaxially through the outlet opening; wherein at least one element selected from the power of the illumination laser source and the spectral range of the illumination laser beam is selected such that the illumination by the illumination laser beam is brighter than a self-emission of the workpiece in a machining region during laser machining. Additionally, a method for laser machining a workpiece is also included in the present disclosure.

Machining apparatus for laser machining a workpiece and method for laser machining a workpiece

A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.

A beam machining head () for beam cutting of a workpiece is provided, having an interface () for an energy beam source () for generating a focused machining energy beam () selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening () for the machining energy beam bounded by an opening edge (); an optical detector unit () for recording at least one image of an electromagnetic radiation () emitted from the workpiece () through the exit opening into the beam machining head () and induced in the workpiece by the machining energy beam; and a monitoring unit () connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit () has: a first determination module for determining at least one position () of the exit opening in the at least one image; a second determination module for determining at least one position () of the centre of the emitted electromagnetic radiation in the at least one image; and a third determination module for determining the positional relationship between the at least one position () of the centre of the emitted electromagnetic radiation and the at least one position () of the exit opening (). A beam machining device and a method for beam cutting are further disclosed.

Beam machining head and method for beam machining

A machining head for the laser machining of a workpiece. The machining head may include a first interface for a machining laser source for emitting a machining laser beam, a second interface for an illumination light source for emitting an illumination light beam, an exit opening for the machining laser beam and the illumination light beam, a third interface for a detector device for detecting the illumination light beam reflected from the workpiece, and guide optics for at least partial coaxial guiding of the emitted illumination light beam through the exit opening and of the illumination light beam reflected from the workpiece, through the exit opening, to the third interface. The guide optics have a polarising beam splitter for guiding at least part of the emitted illumination light beam in the direction of the exit opening, and a retardation plate between the polarising beam splitter and the exit opening.

Machining head and method for laser machining

An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.

Optical unit for laser machining of a workpiece and laser machining device

A method for process monitoring of a laser machining process for estimating a machining quality is dicloses. The method may include steps, which are carried out in real time during the machining process of providing at least one captured first signal sequence with a first feature form a machining zone, providing at least one captured second signal sequence with a second feature from the machining zone, and accessing a trained neural network with at least the recorded first and second signal sequences in order to calculate a result for estimating the machining quality.

Quality control of a laser machining process using machine learning

According to the present application, a machining apparatus () for the laser machining of a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), a second interface () for a detector device (for detecting radiation () emitted by the machining zone (); an outlet opening () for the machining laser beam (); and first and second laser beam guiding devices (), wherein the first laser beam guiding device (),) is arranged and designed such that it guides the machining laser beam () to the second laser beam guiding device () and dynamically moves the machining laser beam (), and the second laser beam guiding device () is arranged and designed such that it guides the dynamically moved machining laser beam () through the outlet opening () and at least partially guides the radiation () emitted by the machining zone () through the outlet opening to the second interface (). Further provided is a method for the laser machining of a workpiece ().

Machining apparatus for the laser machining of a workpiece and method of the laser machining of a workpiece

A machining apparatus for laser machining a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), an outlet opening () for the machining laser beam (), In an optical system between the first interface () and the outlet opening (), which has at least one laser beam guiding device () having at least one movable surface () and at least one actuator (), with which the movable surface () is dynamically adjustable, and a cooling device () for cooling the at least one actuator (), wherein the cooling device () has at least one primary circuit () through which a first cooling fluid can flow without contact with the actuator (). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece () and a method of laser machining a workpiece () using such machining apparatus are also provided.

Machining apparatus for laser machining a workpiece, set of parts for a machining apparatus for laser machining a workpiece and method for laser machining a workpiece using such machining apparatus

The present disclosure relates to a metal machining apparatus having a gas nozzle for generating a gas jet. The apparatus also has a nozzle exit opening on one end on the outside; an electronic camera for acquiring a digital image of the end of the gas nozzle with the nozzle exit opening. The apparatus also includes a pattern recognition module for mapping the digital image to at least one nozzle pattern from the group of nozzle state and/or nozzle type.

Nozzle state or type identification in a metal machining apparatus

Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure.

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Burgdorf, Switzerland

Andreas Luedi