Ixys Corporation

Siemens Aktiengesellschaft

Ixys Semiconductor Gmbh

Leiner Gmbh

Andreas Lindemann

Nathan Zommer

Gerhard Mitic

Bernt Leukel

Jimmy-Alexander Butron-Ccoa

Jürgen Schulz

Jimmy Alexander Butron-Ccoa

The present disclosure relates to power semiconductor modules. The teachings thereof may be embodied in modules with a power semiconductor component and methods, as well as a circuit arrangement. For example, a method may include: developing a thermal model of the power semiconductor module at a reference time point; establishing a reference temperature based on the thermal model; measuring a temperature-sensitive electrical parameter of the power semiconductor module during operation of the power semiconductor module; determining a current temperature from the measured temperature-sensitive electrical parameter of the power semiconductor module; calculating a temperature difference between the current temperature and the reference temperature; and determining a deterioration of the power semiconductor module based on the calculated temperature difference.

Method for determining a deterioration of power semiconductor modules as well as a device and circuit arrangement

A power supply circuit, comprising a first reverse blocking transistor coupled to an AC power line; a second reverse blocking transistor coupled to the AC power line; a first inductor provided between the first reverse blocking transistor and the AC power line and configured to store energy; a first diode having a first terminal that is coupled to one end of the first inductor; a first capacitor having a terminal that is coupled to a second terminal of the first diode; and a first output terminal provided between the first diode and the first capacitor. The first and second transistors are arranged in an anti-parallel configuration and together define an AC switch.

Switching power supply with direct conversion off AC power source

A method for operating an alternating-current (AC) controller system includes providing a first bi-directional switch coupled to a load and an AC power source. The first bi-directional switch is a solid-state device. The first switch is turned on in a first half-cycle of an AC cycle. The first switch is turned off in the first half-cycle of the AC cycle.

AC controller with reverse blocking IGBT

The invention relates to a power semiconductor module ( ) having a baseplate ( ) on which at least one substrate ( ) is arranged which is fitted with power semiconductor chips ( ) and can be pressed via pressure elements and contact cords ( ) against the baseplate ( ). The baseplate ( ) has centering elements on which a frame ( ) which defines fields ( ) and is in the form of a grid is provided, with corresponding substrates ( ) with power semiconductor chips being arranged in at least some of the fields ( ), which substrates ( ) can be made contact with via contact rails ( ).

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Magdeburg, Germany

Andreas Lindemann