Robert Boschgmbh

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Würth Elektronik Gmbh &co. Kg

Andreas Kugler

Bernhard Lucas

Juergen Seiz

Frank Schatz

Klaus Voigtlaender

Thomas Beez

Herbert Olbrich

Heinz Eisenschmid

Alexander Fischer

Ulrich Schaaf

Kurt Weiblen

Armin Himmelstoss

Joachim Hauk

Hermann Mayer

Juergen Hildebrandt

Eberhard Moess

Sabine Koerber

Joachim Dutzi

Adrian Severin Matusek

Achim Dieterich

Manfred Leiter

Marcel Mayer

Klaus Baur

Ulrich Wieduwilt

Johannes Meyer

Helmut Baumann

Klaus Winter

Peter Kimmich

Markus Hanisch

Martin Schneider

Andreas Reppich

Markus Mueller

Istvan Denes

Klaus-Dieter Miosga

Andreas Reichert

Alexander Neumann

Stefan Apelt

Osama Khan

Guenter Bertsch

Linda Klein

Daniel Schoenfeld

Wolfgang Ehrlinger

Corinne Grevent

Ruben Wahl

Anne Bochow

Karl-Friederich Becker

Jan Kostelnik

Udo Freitag

Anette Fein

Norbert Noethen

Berend Oberdorfer

Guido Steude

Isabel Zander

Torsten Maenz

Christian Silber

Matthias Mahlich

Berhard Lucas

Helmeut Baumann

Sandra Woehr

Metin Koyuncu

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

Radar sensor including waveguide structure

A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Method for manufacturing camera modules and a camera module array

A method for manufacturing a camera module, the camera module including a circuit carrier, an image sensor and an optical system holder, including: mounting the image sensor on the circuit carrier; applying a protective layer to the circuit carrier, in which the image sensor is not covered by the protective layer and the protective layer simultaneously forms the optical system holder.

An antenna system and a method for manufacturing same. The antenna system includes a substrate having a first outer side on which a first antenna structure is mounted; a radome spaced apart from the substrate on the first outer side of the substrate; a carrier device situated between the substrate and the radome which includes an insulating material; and at least one second antenna structure mounted on the carrier device which is spaced apart from the substrate and the radome.

Antenna system and method for manufacturing an antenna system

A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.

Method for manufacturing an electronic assembly

In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Method for producing an electronic subassembly

A microwave oscillator having a hollow conductor, an oscillation generator which is mounted on a heatsink and projects into the hollow conductor, and a printed circuit board having electronic components for supplying direct voltage to the oscillation generator. The printed circuit board or a metallic coating on, in, or under this printed circuit board forms one wall of the hollow conductor, and the oscillator including its heatsink is located in the printed circuit board.

Microwave oscillator

A device for generating electromagnetic oscillations in the HF range, in particular in the gigahertz range, using at least one Gunn element, in particular at least one Gunn diode. The device is designed to be attached to at least one printed-board-like electric or electronic circuit configuration, in particular an electric or electronic HF circuit configuration, having a generally planar expansion.

Device for generating oscillations in the high frequency range

The circuit device has a contact element, which electrically connects a wave guide (1) with a conductor strip (2). To avoid mechanical stresses due to thermal expansion the contact element is a pre-stressed prefabricated leaf spring having reproducible properties, which is bonded at one contacting area to the wave guide (1) or the conductor strip (2) by electrically conducting adhesive or glue, while a sliding contact is provided on the conductor strip (2) or the wave guide (1) at the other contacting area. The prefabricated leaf spring is preferably a MIGA leaf spring precisely made by UV depth lithography and multiplayer galvanic methods in a batch production process.

Circuit device with a contact element for electrically connecting a wave guide and a conductor strip in a nearly stress-free manner

A device for a radar system, the device being supplied with the received signals of at least two receiving antennas as input signals, and in which the output signals of this device are supplied to at least one unit for evaluating the received signals which includes at least two evaluation channels. Different input channels are allocated to the at least two evaluation channels as a function of supplied control signals.

Device for a radar system

A housing for an electronic component is described, in particular a Gunn element for generating radar waves, including a bottom part, a wall part made of a plastic that can be processed by injection molding in particular and a cover part enclosing the electronic component in the installed state. The cover part has a contact spring for establishing an electric connection to a terminal of the component. In addition, the wall part is connected to the cover part by at least one connecting structure.

Housing for an electronic component

The arrangement for producing electrical oscillations in a Giga hertz region has a Gunn element, a housing in which the Gunn element is accommodated and which has an electrically conductive housing cover, the Gunn element being in electrical contact with the electrically conductive housing cover, and an elastic, electrical contact element clamped between a contact surface of the Gunn element and the housing cover.

Arrangement for producing electrical oscillations

A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.

Housing for electronic component, and method of producing the same

Growing community of inventors

Alfdorf, Germany

Andreas Kugler