Enthone Incorporated

Other

Macdermid Enthone Gmbh

Volkswagen Ag

Andreas Königshofen

Christoph Werner

Danica Elbick

Andreas Möbius

Ulrich Prinz

Peter Pies

Mark Peter Schildmann

Frank Noffke

Markus Dahlhaus

Axel Fuhrmann

Wolfgang Clauberg

Ronny Kiefer

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

Chromium-free plating-on-plastic etch

The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.

Method for direct metallization of non-conductive substrates

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises

Electrolyte and process for depositing a matt metal layer

An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl, FeCl, TiCl, CaCl, CuCl, CrCl, ZnCl, MgCl, MnCl, and Cr(NO); and a related method for etching.

Method for etching non-conductive substrate surfaces

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Leverkusen, Germany

Andreas Königshofen