Wacker Chemie Ag

Andreas Koellnberger

Frank Achenbach

Alfred Schwinghammer

Wolfgang Ziche

Michael Stepp

Klaus Eller

Johannes Neuwirth

At least one silicone layer is applied to a substrate by a method employing laser transfer printing. The method is suitable for producing sensors, actuators and other EAP layer systems. The silicone layer in these systems may serve as an electrically conducting electrode layer or as a dielectric layer. The method may be configured to be continuous and may be combined with various other coating technologies.

Method for applying at least one silicone layer by laser transfer printing

Generation of cyclic siloxanes in silicone compositions containing quartz flour as a filer is reduced by incorporating a basic substance into the composition prior to adding filler.

Quartz-containing silicone compositions which are low in cyclic compounds

Multilayer silicone composites with precise thickness are produced by sequential extrusion of curable silicone films, and partially but not fully crosslinking a preceding silicone film prior to extruding a next subsequent film.

Method for producing silicone multi-layer composites

Cyclopentadienyl platinum complexes bearing ethylenic unsaturation are efficient photocatalysts for hydrosilylation of compounds containing aliphatic carbon-carbon multiple bonds, while exhibiting extended dark time, and are particularly useful in addition-curable organopolysiloxane compositions.

Platinum complexes and their use in compounds that can be cross-linked by a hydrosilylation reaction

Vulcanizates produced by crosslinking of mixtures including alpha-functional polysiloxanes have high relative permittivities at high electric breakdown strengths which renders them suitable as a dielectric material for applications in actuators, generators or sensors in robotics, orthopedics, electrically controllable 'artificial muscles,' and transducers producing electricity from kinetic energy.

Cross-linkable mixtures having alpha-functional polysiloxanes

Thin silicon films of high thickness uniformity and thicknesses of from 0.1 &#x3bc;m to 200 &#x3bc;m are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.

Production of thin silicone films

Addition curing silicone elastomers of high Shore D hardness are grindable and polishable, and are particularly useful as temporary adhesives in the processing of semiconductor wafers.

Abradable silicone elastomer compound and use thereof

Cured or uncured silicones are effectively removed from substrates with minimized substrate corrosion by the use of a silicone dissolver containing a tetralkylammonium fluoride and an inorganic base, dissolved in a solvent.

Silicone solvent

A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.

Temporary adhesion of chemically similar substrates

A composition comprising a phosphonitrile halide and an oligomeric organopolysiloxanes having from 10 to 50 Si units is effective to remove silicone residues from substrates with minimal swelling of thin polymer substrates.

&#x3b7;-cyclopentadienyl-tri(&#x3c3;-hydrocarbyl) platinum compounds in which the cyclopentadienyl ring is linked to a hydrolysable silyl group by an alkylene group are effective light-activated hydrosilylation catalysts which are also non-volatile.

Growing community of inventors

Kirchdorf, Germany

Andreas Koellnberger