Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Andreas Kirbs

Dirk Rohde

Heiko Brunner

Torsten Voss

Jan Sperling

Grigory Vazhenin

Mauro Castellani

Stefan Pieper

Lars Kohlmann

Olivier Mann

Bernd Roelfs

Stefanie Ackermann

Jörg Schulze

Agnieszka Witczak

Timo Bangerter

Christian Ohde

Christian Wendeln

Sebastian Zarwell

Angelo Ferro

Andre Schmökel

Jöerg Schulze

Aylin Machmor

Bernd Fröese

Ulrike Engelhardt

Mayumi Nishikido

Kevin-Sigurt Gottschalk

Edith Steinhäuser

Mutlu-Iskender Muglali

Bernd Fröse

Aylin Sönmez

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.

Method for monitoring the total amount of sulphur containing compounds in a metal plating bath

An aqueous indium or indium alloy plating bath comprising  

Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps

Process for indium or indium alloy deposition and article

The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath.

Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives are thiourea compounds or derivatives which have the general formula (A): wherein Xand Xmay be the same or different and are selected from the group consisting of arylene and heteroarylene; FGand FGmay be the same or different or are selected from the group consisting of &#x2014;S(O)OH, &#x2014;S(O)OH, &#x2014;COOH, &#x2014;P(O)OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers from 1 to 5.

Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)&#x2014;group 13 (IIIA)&#x2014;Group 16 (VIA)

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Berlin, Germany

Andreas Kirbs