Infineon Technologies Ag

Andreas Karl

Frank Pueschner

Peter Scherl

Andreas Mueller-Hipper

Andreas Muller-Hipper

Frank Puschner

Matthias Gruenauer

Juergen Hoegerl

Peter Stampka

Ewald Simmerlein-Erlbacher

Kristof Bothe

Uwe Wagner

A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Smart card module for a smart card

In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.

Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay

A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.

Document for personal identification having protection against external manipulations and a method for producing

Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

Module for contactless chip cards or identification systems

Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.

Growing community of inventors

Tegernheim, Germany

Andreas Karl