Heraeus Deutschland Gmbh & Co Kg

Yageo Nexensos Gmbh

Andreas Hinrich

Frank Osterwald

Lars Paulsen

Frank Krüger

Wolfgang Schmitt

Michael Schäfer

Andreas Steffen Klein

Martin Becker

Jacek Rudzki

Holger Ulrich

Susanne Klaudia Duch

Thomas Krebs

Michael Benedikt

Martin Bleifuss

David Benning

Stephan Urfels

Michael Lemmer

Yvonne Loewer

Michael Schaefer

Anton Miric

Alexander Brand

Christian Bachmann

Frank Schefuss

Andreas Klein

Elisa Wieseler

Martin Bleifuß

Ulrich Holger

Elisa Krill

One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Method for producing a substrate adapter and substrate adapter for connecting to an electronic component

One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

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Freigericht, Germany

Andreas Hinrich