Osram Opto Semiconductors Gmbh

Andreas Gruendl

Markus Pindl

Tobias Gebuhr

Stefan Gruber

A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.

Optoelectronic component and method of production thereof

An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.

Optoelectronic component

In at least one embodiment of the optoelectronic semiconductor component (), the optoelectronic semiconductor component has a support (). At least one optoelectronic semiconductor chip () with a radiation outlet face () is applied onto a support upper face (). A sacrificial layer () is located over the radiation outlet face () in the direction away from the support (). A housing body () which has a housing upper face () is molded around the semiconductor chip () and/or around the sacrificial layer () in a lateral direction parallel to the radiation outlet face (). A sacrificial layer () upper face () which faces away from the radiation outlet face () is free of a housing body () material.

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Laaber, Germany

Andreas Gruendl