Lam Research Ag

Semsysco Gmbh

Semsyso Gmbh

Andreas Gleissner

Thomas Wirnsberger

Rainer Obweger

Herbert Ötzlinger

Ulrich Tschinderle

Oliver Knoll

Franz Kumnig

Bhaskar Bandarapu

Franz Markut

Ivan L Berry, Iii

Michael Brugger

Philipp Engesser

Rafal Ryszard Dylewicz

Christian Thomas Fischer

Raoul Schröder

Mu Hung Chou

Alessandro Baldaro

Nathan Lavdovsky

Harald Okorn-schmidt

Georg Hofer

Harald F Okorn-Schmidt

Dieter Frank

Hongbo Si

Bernhard Loidl

Herbert Oetzlinger

Marianne Kolitsch-MataIn

Peter Strutzmann

Thomas Wimsberger

Robert Rogatschnig

Manuel Eibl

Markus Gersdorff

Markus Junk

Harald Modl

Marianne Kolitsch-mataln

The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a method for manufacturing the distribution system. The distribution system comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate.

Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.

Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate

The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).

The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: —an end effector, —a straightening ring, and —a suction cup. The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.

Substrate handling device for a wafer

The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.

Substrate holding and locking system for chemical and/or electrolytic surface treatment

The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket. At least a portion of the actuation unit is moveable relative to the clipping bracket to move the first arm in the receiving position or the fastening position.

Clipping mechanism for fastening a substrate for a surface treatment of the substrate

The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

Module for chemically processing a substrate

The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:

Method and device for plating a recess in a substrate

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment

A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.

Method and apparatus for processing wafer-shaped articles

An exemplary distribution system, apparatus and method can be provide for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system can comprise a distribution body and a control unit. The distribution body can be configured to direct a flow of the process fluid and/or an electrical current to the substrate. The distribution body can comprise at least a first distribution element and a second distribution element. The control unit/device can be configured to control the first distribution element and the second distribution element separately from one another.

Distribution system for chemical and/or electrolytic surface treatment

A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

Apparatus for treating surfaces of wafer-shaped articles

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Dobriach, Austria

Andreas Gleissner