Institut Fuer Neue Materialien Gemeinnuetzige Gmbh

Az Electronic Materials (Germany) Gmbh

Andreas Gier

Helmut Schmidt

Martin Mennig

Peter William Oliveira

Michael Meier

Stefan Sepeur

Walter Spiess

Fumio Kita

Nora Kunze

Bruno Schaefer

The invention relates to a method for microstructuring electronic components, which yields high resolutions (&#x2266;200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claimis produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF/Oplasma; vii) the bottom coat is plasma etched, preferably with Oplasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.

Nanoimprint resist

A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.

Method for producing a microstructured surface relief by embossing thixotropic layers

A coating composition comprises a polycondensate obtained by reacting a prehydrolysate based on at least on epoxide-containing hydrolysable silane; at least one amine component selected from a prehydrolysate based on at least one amino-containing hydrolysable silane and an amine compound containing at least two amino groups; and an amino group protective reagent. The coating composition is particulary suitable for coating glass, glass ceramic, ceramic, and plastic, and permits an increase in strength and protection against damage.

Coating composition, based on organically modified inorganic condensates

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Melle, Germany

Andreas Gier