Koninklijke Philips Corporation N.V.

U.S. Philips Corporation

Nxp B.v.

Andreas Gakis

Wolfgang Schnitt

Ronald Dekker

Theodorus Martinus Michielsen

Henricus Godefridus Rafael Maas

Hauke Pohlmann

Michael Burnus

Ralph Busskamp

Johann-Heinrich Fock

Martin Schaefer

In order to provide a method of detaching a thin semiconductor circuit () from its base (), wherein the semiconductor circuit () is provided with terminals () for electrical contacting, in particular with gold contacts, by means of which method thin semiconductor circuits () can also be mounted without damage for example directly on a chip card, it is proposed that a layer of soldering tin () is applied to a support substrate (), the support substrate () is soldered to the electrical terminals () and the base () of the semiconductor circuit () is removed.

Method of detaching a thin semiconductor circuit from its base

Flexible integrated monolithic circuit

A support element of an automatic load platform of a silicon wafer exposure unit, having a circular cross-section, with a first outer diameter adapted to the guide of a load station, which diameter is smaller than that of a silicon wafer, wherein the circular disc of the support element has at its circumference in a direction parallel to the insertion direction of the load station at least partly enlarged portions and therewith a second outer diameter which corresponds approximately to that of the silicon wafer, and wherein the greatest width of the support element at right angles to the insertion direction corresponds to that of the circular disc.

Support element for an automatic load platform of a silicon wafer

Growing community of inventors

Hamburg, Germany

Andreas Gakis