Robert Boschgmbh

Andreas Fischer

Wolfgang E Mueller

Rainer Topp

Rolf Becker

Ulrich Goebel

Christoph Ruf

Dirk Balszunat

Andreas Thomae

Erwin Naegele

Joerg Gebers

Juergen Schwaiger

Martin Knapp

An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Electronic system for fixing power and signal semiconductor chips

A sensor arrangement has a housing, a pressure detector having a measuring diaphragm which is deflectable by a pressurized measurement medium, a sensor circuit attached directly to the measuring diaphragm, an electronic evaluation circuit connected to the sensor circuit and formed as a hybrid circuit, a connector contacted by an element selected from the group consisting of the sensor circuit, the evaluation circuit and both, the hybrid circuit being fastened directly to the measuring diaphragm by a conductive glue which produces electrical connections between the hybrid circuit and the sensor circuit fastened to the measuring diaphragm and produces a ground connection to the housing.

Sensor arrangement with pressure detector and sensor circuit

In a method for producing a pressure sensor, a ceramic plate is joined to a shaped ceramic part. The shaped ceramic part has a depression. Around the depression there is provided a thick-layer paste which does not completely surround the depression. As a result, the air can escape from the depression during firing and a subatmospheric pressure can thus be enclosed in the depression.

Method for producing a pressure sensor

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Wannweil, Germany

Andreas Fischer